キーワード:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
-
2015,
Vassilev A, Ferber A, Wehrmann C, Pinaud O, Schilling M, Ruddle AR
IEEE Trans Electromagn Compat 57 (6): 35-43
-
2015,
Ardavan M, Trueman CW, Schmitt KA
IEEE Trans Electromagn Compat 57 (6): 69-79
-
2015,
Bamba A, Gaillot DP, Tanghe E, Vermeeren G, Joseph W, Lienard M, Martens L
IEEE Trans Electromagn Compat 57 (6): 27-34
-
2014,
Carsimamovic A, Mujezinovic A, Carsimamovic S, Muharemovic A, Bajramovic Z
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 611-614; ISBN 978-1-4799-3226-9
-
2014,
Laissaoui AM, Nekhoul B, Poljak D, Kerroum K, Drissi KE
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 974-979; ISBN 978-1-4799-3226-9
-
2014,
Yngve Hamnerius, Tomas Nilsson
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 364-368; ISBN 978-1-4799-3226-9
-
2014,
Döbbelin R, Förster S, Lindemann A
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 369-374; ISBN 978-1-4799-3226-9
-
2014,
Lisewski T, Luszcz J
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 360-363; ISBN 978-1-4799-3226-9
-
2014,
Kavya M, Yashodhara B, Arunachalam V, Devendranath D, Yellaiah A, Rashmi, Sailaja RRN
2014 International Conference on Power Signals Control and Computations (EPSCICON), Thrissur, India. IEEE: 1-6
-
2014,
Ptitsyna NG, Ponzetto A, Kopytenko YA, Ismagilov VS, Korobeinikov AG
J Sci Res Rep 3 (13): 1753 - 1770
-
2014,
Theodoridis MP, Mollov SV
Biomed Tech 59 (5): 461-469
-
2014,
Marshman CA, Armstrong R, Dawson L, Rowell AJ, Ruddle AR
5th IET Hybrid and Electric Vehicles Conference (HEVC 2014), London, UK. IET: 14737980; ISBN 978-1-84919-911-7
-
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 354-359; ISBN 978-4-88552-287-1
-
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 348-353; ISBN 978-4-88552-287-1
-
2014,
Haridim M, Levin B, Revich S, Chulski S, Sauleau R, Zemach R
IEEE Electromagn Compat Mag 3 (4): 43-48
-
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 745-748; ISBN 978-4-88552-287-1
-
2014,
Diao YL, Sun WN, Chan KH, Leung SW, Siu YM
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 226-229; ISBN 978-4-88552-287-1
-
2014,
Laakso I, Hirata A, Fujiwara O
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 202-205; ISBN 978-4-88552-287-1
-
2014,
Sunohara T, Laakso I, Hirata A, Onishi T
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 449-452; ISBN 978-4-88552-287-1
-
2014,
Nagaoka T, Watanabe S, Niwa T
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 190-193; ISBN 978-4-88552-287-1
-
2014,
Sasaki K, Nagaoka T, Wake K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 537-540; ISBN 978-4-88552-287-1
-
2014,
Tateno A, Tanaka K, Nagaoka T, Watanabe S, Saito K, Takahashi M, Ito K
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 186-189; ISBN 978-4-88552-287-1
-
2014,
Kim M, Kim S, Ahn S, Chun Y, Park S
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 426-429; ISBN 978-4-88552-287-1
-
2014,
Wiart J, Conil E, Varsier N, Sarrebourse T, Hadjem A, Martens L, Wermeeren G, Corre Y
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 635-637; ISBN 978-4-88552-287-1
-
2014,
Shiina T, Suzuki Y, Kasai Y, Inami Y, Taki M, Wake K
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 166-169; ISBN 978-4-88552-287-1