キーワード:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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IEEE Trans Electromagn Compat [in press]
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2024,
Yamaguchi-Sekino S, Ikuyo M, Tobita K, Onishi T, Taki M, Watanabe S
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, Brugge, Belgium. IEEE: pp. 573-578; ISBN 9798350343045
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2024,
Cruciani S, Campi T, Maradei F, Feliziani M
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, Brugge, Belgium. IEEE: pp. 816-820; ISBN 9798350343045
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2024,
Hassab Y, Esmaeili H, Schuster C
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, Brugge, Belgium. IEEE: pp. 584-589; ISBN 9798350343045
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2024,
Faraone A, Bit-Babik G, Russo P, De Leo A, Mariani Primiani V, De Santis V
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, Brugge, Belgium. IEEE: pp. 957-960; ISBN 9798350343045
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2024,
Miwa K, Ota S, Kawai K
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, Brugge, Belgium. IEEE: pp. 92-97; ISBN 9798350343045
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2024,
Ankarson P, Bergqvist B
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, Brugge, Belgium. IEEE: pp. 590-594; ISBN 9798350343045
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2024,
Bellosono L, D’ Agostino S, Colella M, Contessa GM, Polichetti A, Liberti M, Apollonio F
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, Brugge, Belgium. IEEE: pp. 579-583; ISBN 9798350343045
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2024,
Stroka S, Haussmann N, Kasolis F, Clemens M
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, Brugge, Belgium. IEEE: pp. 762-767; ISBN 9798350343045
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2024,
Zuo Z, Wang Q, Zheng J, Jeong H, Kumar A, Chen J
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: pp. 369-373; ISBN 9798350360400