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Beynel L, Dannhauer M, Palmer H, Hilbig SA, Crowell CA, Wang JE, Michael AM, Wood EA, Luber B, Lisanby SH, Peterchev AV, Cabeza R, Davis SW, Appelbaum LG
2021 IEEE International Conference on the Properties and Applications of Dielectric Materials (ICPADM), Johor Bahru, Malaysia. IEEE: pp. 386-389; ISBN 978-1-7281-8239-1