2020 13th International Congress on Image and Signal Processing, BioMedical Engineering and Informatics (CISP-BMEI), Chengdu, China. IEEE: pp. 619-623; ISBN 978-0-7381-0546-8
2020,
Kletzel SL, Aaronson AL, Guernon A, Carbone C, Chaudhry N, Walsh E, Conneely M, Patil V, Roth E, Steiner M, Pacheco M, Rosenow J, Bender Pape TL