キーワード:
"Radio Frequency Identification", Hochfrequenz-ldentifizierung, RFID, 無線周波識別法
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2019,
Driessen S, Napp A, Schmiedchen K, Kraus T, Stunder D
Europace 21 (2): 219-229
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2018,
Qi Y, Wu J, Gong G, Fan J, Orlandi A, Yu W, Ma J, Drewniak JL
IEEE Trans Electromagn Compat 60 (5): 1152-1160
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2018,
Caccami MC, Hogan MP, Alfredsson M, Marrocco G, Batchelor JC
IEEE Trans Antennas Propag 66 (2): 609-617
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2018,
Periyasamy M, Dhanasekaran R, Mahendran G
2018 International Conference on Communication and Signal Processing (ICCSP), Chennai, India. IEEE: pp. 0911-0917; ISBN 978-1-5386-3522-3
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2018,
Herrala M, Kumari K, Blomme A, Khan MW, Koivisto H, Naarala J, Roivainen P, Tanila H, Viluksela M, Juutilainen J
Eskola H, Väisänen O, Viik J, Hyttinen J (eds.): EMBEC & NBC 2017: Joint Conference of the European Medical and Biological Engineering Conference (EMBEC) and the Nordic-Baltic Conference on Biomedical Engineering and Medical Physics (NBC), Tampere, Finland, June 2017. IFMBE Proceedings, 65巻; Springer, Singapore; pp. 719-722; ISBN 978-981-10-5121-0
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2018,
Zradzinski P, Karpowicz J, Gryz G
2018 EMF-Med 1st World Conference on Biomedical Applications of Electromagnetic Fields (EMF-Med), Split, Croatia. IEEE: pp. 1-2; ISBN 978-1-5386-5922-9
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2018,
Vila J, Turner MC, Gracia-Lavedan E, Figuerola J, Bowman JD, Kincl L, Richardson L, Benke G, Hours M, Krewski D, McLean D, Parent ME, Sadetzki S, Schlaefer K, Schlehofer B, Schüz J, Siemiatycki J, van Tongeren M, Cardis E, INTEROCC Study Group
Environ Int 121 Pt 1: 1025-1026
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2018,
Hirtl R, Bodewein L, Schmiedchen K, Dechent D, Stunder D, Gräfrath D, Winter L, Kraus T, Driessen S, Schmid G
Federal Office for Radiation Protection (BfS),
Ressortforschungsberichte zur kerntechnischen Sicherheit und zum Strahlenschutz, BfS-RESFOR-139/18: 1-198
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2018,
Yildiz BS, Findikoglu G, Alihanoglu YI, Kilic ID, Evrengul H, Senol H
Rehabil Res Pract 2018: 5689353
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2018,
Vila J, Turner MC, Gracia-Lavedan E, Figuerola J, Bowman JD, Kincl L, Richardson L, Benke G, Hours M, Krewski D, McLean D, Parent ME, Sadetzki S, Schlaefer K, Schlehofer B, Schüz J, Siemiatycki J, van Tongeren M, Cardis E, INTEROCC Study Group
Environ Int 119: 353-365