キーワード:
"Institute of Electrical and Electronics Engineers", IEEE, 米国電気電子学会
-
1973,
del Blanco JB, Romero-Sierra C, Tanner JA
1973 IEEE International Electromagnetic Compatibility Symposium Record, New York, NY, USA. IEEE: pp. 1-6; ISBN 978-1-5090-3159-7
-
1973,
Ho HS, Ginns EI, Christman CL
1973 IEEE G-MTT International Microwave Symposium, Boulder, CO, USA. IEEE: pp. 255-256
-
1973,
Haidt SJ, McTighe AH
1973 IEEE G-MTT International Microwave Symposium, Boulder, CO, USA. IEEE: pp. 324-325
-
1973,
Singewald ML, Langworthy OR, Kouwenhoven WB
IEEE Transactions on Power Apparatus and Systems PAS-92 (4): 1307-1309
-
1973,
Geddes LA, Moore AG, Rosborough J, Tacker WA
IEEE Trans Biomed Eng 20 (6): 465-468
-
IEEE Trans Communications 21 (9): 1015-1027
-
1973,
Lin JC, Guy AW, Johnson CC
IEEE Trans Microw Theory Tech 21 (12): 791-797
-
1973,
Ho HS, Ginns EI, Christman CL
IEEE Trans Microw Theory Tech 21 (12): 837-840
-
1973,
Bonney CH, Rustan Jr PL, Ford GE
IEEE Trans Biomed Eng 20 (5): 357-364
-
1973,
Huhta JC, Webster JG
IEEE Trans Biomed Eng 20 (2): 91-101
-
IEEE Spectr 9 (2): 41-50
-
Proc IEEE 60 (6): 692-718
-
1972,
Kritikos HN, Schwan HP
IEEE Trans Biomed Eng 19 (1): 53-58
-
IEEE Trans Biomed Eng 19 (4): 304-312
-
IEEE Trans Microw Theory Tech 19 (2): 251-253
-
1971,
Kaplan IT, Metlay W, Zaret MM, Birenbaum L, Rosenthal SW
IEEE Trans Microw Theory Tech 19 (2): 168-173
-
1971,
Schuder JC, Gold JH, Stephenson Jr HE
IEEE Trans Biomed Eng BME-18 (4): 265 - 273
-
1971 IEEE International Electromagnetic Compatibility Symposium Record, Philadelphia, PA, USA. IEEE: pp. 155-161; ISBN 978-1-5090-3157-3
-
IEEE Transactions on Industry and General Applications 7 (1): 10-16
-
1971,
Samaras GM, Muroff LR, Anderson GE
IEEE Trans Microw Theory Tech 61 (5): 245-247
-
1971,
Wacker PF, Bowman RR
IEEE Trans Microw Theory Tech 19 (2): 178-187
-
1971,
Carpenter RL, Livstone EM
IEEE Trans Microw Theory Tech 19 (2): 173-178
-
IEEE Trans Microw Theory Tech 19 (2): 205-214
-
1970 IEEE Electromagnetic Compatibility Symposium Record, Anaheim, CA, USA. IEEE: pp. 168-172; ISBN 978-1-5090-3156-6
-
IEEE Spectr 6 (2): 44-50