キーワード:
"Institute of Electrical and Electronics Engineers", IEEE, 米国電気電子学会
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2021,
Zhao Z, Wu Z, Peng Z, Li Y, Zhang W, Yang G
2021 IEEE International Conference on the Properties and Applications of Dielectric Materials (ICPADM), Johor Bahru, Malaysia. IEEE: 386-389; ISBN 978-1-7281-8239-1
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2021,
Cvetković M, Poljak D, Kapetanović AL, Dodig H
2021 International Conference on Software, Telecommunications and Computer Networks (SoftCOM), Split, Hvar, Croatia. IEEE: 1-6; ISBN 978-1-6654-2456-1
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2021,
Antwi OA, Owusu AO, Nanjo JW, Gidisu GB, Sackey D, Mohammed H
2021 International Conference on Computing, Computational Modelling and Applications (ICCMA), Brest, France. IEEE: 92-97; ISBN 978-1-6654-2568-1
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2021,
Andersen E, Casados C, Truong BD, Roundy S
IEEE Trans Electromagn Compat 63 (5): 1735-1747
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2021,
Haider Z, Nikolayev D, Le Dréan Y, De Angelis A, Liberti M, Sauleau R, Zhadobov M
IEEE J Microw 1 (4): 1003-1014
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2021,
Gammon T, Vigstol D
2021 IEEE IAS Electrical Safety Workshop (ESW), Tucson, AZ, USA. IEEE: 1-9; ISBN 978-1-6654-4636-5
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2021,
Zhang G, Song X, Yu Z, An X
IEEE Antennas Wirel Propag Lett 20 (10): 1918-1922
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2021,
Nour AA, Shubitidze F
2021 IEEE 26th International Seminar/Workshop on Direct and Inverse Problems of Electromagnetic and Acoustic Wave Theory (DIPED), Tbilisi, Georgia. IEEE: 191-194; ISBN 978-1-6654-0103-6
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2021,
Gokyar S, Robb FJL, Kainz W, Chaudhari A, Winkler SA
IEEE Access 9: 140824-140834
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2021,
Hirata A, Diao Y, Onishi T, Sasaki K, Ahn S, Colombi D, De Santis V, Laakso I, Giaccone L, Joseph W, Rashed EA, Kainz W, Chen J
IEEE Trans Electromagn Compat 63 (5): 1619-1630