キーワード:
"Elektromagnetisches Feld", EMF, "electromagnetic field", 電磁界
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2019,
Ansal KA, Jose DS, Rajan RK
2018 International Conference on Circuits and Systems in Digital Enterprise Technology (ICCSDET), Kottayam, India. IEEE: 1-5; ISBN 978-1-5386-0577-6
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2019,
Bender M, Romei V, Sauseng P
Brain Topogr 32 (3): 477-481
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2019,
Gholami D, Ghaffari SM, Riazi G, Fathi R, Benson J, Shahverdi A, Sharafi M
PLoS One 14 (9): e0221976
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2019,
Bernieri A, Betta G, Cerro G, Miele G, Capriglione D
2019 IEEE International Symposium on Measurements & Networking (M&N), Catania, Italy. IEEE: 1-6; ISBN 978-1-7281-1274-9
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2019,
Kainz A, Steiner H, Hortschitz W, Schalko J, Jachimowicz A, Keplinger F
2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII), Berlin, Germany. IEEE: 2114-2117; ISBN 978-1-5386-8105-3
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2019 IEEE International Symposium on Measurements & Networking (M&N), Catania, Italy. IEEE: 1-5; ISBN 978-1-7281-1274-9
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2019,
Grazian F, Shi W, Dong J, van Duijsen P, Soeiro TB, Bauer P
2019 AEIT International Conference of Electrical and Electronic Technologies for Automotive (AEIT AUTOMOTIVE), Torino, Italy. IEEE: 1-5; ISBN 978-1-7281-3278-5
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2019,
Chung YD, Kim DW, Park EY
2019 10th International Conference on Power Electronics and ECCE Asia (ICPE 2019 - ECCE Asia), Busan, Korea (South). IEEE: 2240-2245; ISBN 978-1-7281-1612-9
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2019,
Barak S, Matalon S, Dolkart O, Zavan B, Mortellaro C, Piattelli A
J Craniofac Surg 30 (4): 1055-1057
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2019,
Wang T, Yang L, Jiang J, Liu Y, Fan Z, Zhong C, He C
Osteoporos Int 30 (2): 267-276