著者:
Remley KA, Gordon JA, Novotny D, Curtin AE, Holloway CL, Simons MT, Horansky RD, Allman MS, Senic D, Becker M, Jargon JA, Hale PD, Williams DF, Feldman A, Cheron J, Chamberlin R, Gentile C, Senic J, Sun R, Papazian PB, Quimby J, Mujumdar M, Golmie N
掲載誌: IEEE Microw Mag 2017; 18 (5): 41 - 56