The following terms were included:
電磁両立性, "elektromagnetische Verträglichkeit", EMC, EMV, "electromagnetic compatibility"
-
2020,
Richter A, Ferková Z, Morava J
2020 ELEKTRO, Taormina, Italy. IEEE: pp. 1-6; ISBN 978-1-7281-7543-0
-
2020,
Gao Z, Zhang W, Chen X
Zhongguo Yi Liao Qi Xie Za Zhi 44 (4): 302-306
-
2020,
Azaro R, Gandolfo A
IEEE Trans Electromagn Compat 62 (4): 1611-1618
-
2020,
Titov EV, Soshnikov AA, Drobyazko ON
2020 International Conference on Industrial Engineering, Applications and Manufacturing (ICIEAM), Sochi, Russia. IEEE: pp. 1-5; ISBN 978-1-7281-4591-4
-
IEEE Electromagn Compat Mag 9 (2): 27-29
-
IEEE Trans Electromagn Compat 62 (4): 1443-1450
-
2020,
Brizi D, Fontana N, Tucci M, Barmada S, Monorchio A
IEEE Trans Electromagn Compat 62 (4): 1312-1322
-
2020,
Rashed EA, Diao Y, Tanaka S, Sakai T, Gomez-Tames J, Hirata A
IEEE Trans Electromagn Compat 62 (6): 2704-2713
-
2020,
Gusarov AV, Rostovtsev VL, Safonov LV, Shurygin SN
Zh Nevrol Psikhiatr Im S S Korsakova 120 (2): 76-80
-
2020,
Arduino A, Bottauscio O, Chiampi M, Giaccone L, Liorni I, Kuster N, Zilberti L, Zucca M
IEEE Trans Electromagn Compat 62 (5): 1939-1950
-
2020,
Wu J, Qi Y, Gong G, Fan J, Miao M, Yu W, Ma J, Drewniak JL
IEEE Trans Electromagn Compat 62 (6): 2604-2612
-
2020,
Liorni I, Lisewski T, Capstick MH, Kuehn S, Neufeld E, Kuster N
IEEE Trans Electromagn Compat 62 (4): 1323-1332
-
2020,
Zheng J, Lan Q, Zhang X, Kainz W, Chen J
IEEE Trans Electromagn Compat 62 (3): 673-681
-
2020,
Attaran A, Handler WB, Chronik BA
IEEE J Electromagn RF Microw Med Biol 4 (1): 2 - 9
-
2020,
Attaran A, Handler WB, Chronik BA
IEEE Trans Electromagn Compat 62 (1): 186 - 193
-
IEEE Trans Electromagn Compat 62 (2): 338-345
-
2019,
Wu I, Matsumoto Y, Gotoh K, Wake K, Watanabe S
2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Barcelona, Spain. IEEE: pp. 169-172; ISBN 978-1-7281-0595-6
-
2019,
Ruddle AR, Martin AJM
IEEE Electromagn Compat Mag 8 (3): 75-85
-
2019,
Le DT, Li K, Watanabe S, Onishi T
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 78-81; ISBN 978-1-7281-1639-6
-
2019,
Hussien HI, Ayob MA, Warsito IF, Supriyanto E, Reihannisha I
2019 International Conference on Technologies and Policies in Electric Power & Energy, Yogyakarta, Indonesia. IEEE: pp. 1-4; ISBN 978-1-7281-5693-4
-
2019,
Bieth F, Delmote P, Schneider M
IEEE Trans Plasma Sci 47 (6): 2987-2994
-
2019,
Liu J, Zheng J, Zeng Q, Wang Q, Rondoni J, Olsen J, Kainz W, Chen J
IEEE Trans Electromagn Compat 61 (4): 1091-1097
-
2019,
Virjoghe EO, Bancuta I, Husu AG, Cazacu D, Florescu V
J Sci Arts No.1 (46): 249-259
-
2019,
Zeng Q, Liu J, Angelone LM, Lloyd T, Wedan S, Chen J, Kainz W
IEEE Trans Electromagn Compat 61 (5): 1423-1431
-
2019,
Botsa VR, Kumar Munaka S, Dushyanth M, Bandaru S
2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON), Bangalore, India. IEEE: pp. 1-4; ISBN 978-1-7281-4153-4
-
2019,
Katkoria V, Ghosh P, Chaudhury B
2019 IEEE MTT-S International Microwave and RF Conference (IMARC), Mumbai, India. IEEE: pp. 1-5; ISBN 978-1-7281-4041-4
-
2019 IEEE 3rd International Electrical and Energy Conference (CIEEC), Beijing, China. IEEE: pp. 1507-1512; ISBN 978-1-7281-1676-1
-
2019,
Cruciani S, Campi T, Maradei F, Feliziani M
2019 IEEE PELS Workshop on Emerging Technologies: Wireless Power Transfer (WoW), London, UK. IEEE: pp. 173-176; ISBN 978-1-7281-0881-0
-
2019,
Geyikoglu MD, Koc Polat H, Cavusoglu B
2019 Fifth International Electromagnetic Compatibility Conference (EMC Turkiye), Kocaeli, Turkey. IEEE: pp. 1-5; ISBN 978-1-7281-1836-9
-
2019,
Ren X, Liu W, Su Z, Wu H, Qiao S, Lu H, Shen G
2019 12th International Congress on Image and Signal Processing, BioMedical Engineering and Informatics (CISP-BMEI), Suzhou, China. IEEE: pp. 1-5; ISBN 978-1-7281-4853-3
-
2019,
Shoaib N, Zaidi SNF, Shafqat A, Cheema HM
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo), Hangzhou, China. IEEE: pp. 210-212; ISBN 978-1-7281-4263-0
-
2019,
Songcen W, Bin W, Xiaokang W, Chong X, Jinxing X, Weimei G, Jiaqi X
2019 22nd International Conference on Electrical Machines and Systems (ICEMS), Harbin, China. IEEE: pp. 1-7; ISBN 978-1-7281-3399-7
-
2019,
Viorica V, Mircea-Emilian A, Paul N, Florel R
2019 International Conference on Electromechanical and Energy Systems (SIELMEN), Craiova, Romania. IEEE: pp. 1-5; ISBN 978-1-7281-4012-4
-
2019,
Škiljo M, Blažević Z, Poljak D
2019 International Conference on Software, Telecommunications and Computer Networks (SoftCOM), Split, Croatia. IEEE: pp. 1-5; ISBN 978-1-7281-3711-7
-
2019,
Kozlov M, Angelone LM, Rajan S
IEEE Trans Electromagn Compat: 2311-2316
-
2019,
Sekiba Y, Yamazaki K
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 83-86; ISBN 978-1-7281-1639-6
-
2019,
Gomez-Tames J, Rashed E, Hirata A, Tarnaud T, Tanghe E, Van de Steene T, Martens L, Joseph W
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 162-165; ISBN 978-1-7281-1639-6
-
2019,
Sasaki K, Li K, Wake K, Watanabe S, Higashiyama J, Onishi T
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 43-46; ISBN 978-1-7281-1639-6
-
2019,
Miwa K, Takenaka T, Hirata A
IEEE Trans Electromagn Compat 61 (6): 2024-2030
-
2019,
Shiina T, Yamazaki K
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 744-747; ISBN 978-1-7281-1639-6
-
2019,
Kageyama I, Masuda H, Morimatsu Y, Ishitake T, Sakakibara K, Hikage T, Hirata A
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 766-769; ISBN 978-1-7281-1639-6
-
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 166-169; ISBN 978-1-7281-1639-6
-
2019,
He Y, Leung PSW, Chow Y, Diao Y
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 750-753; ISBN 978-1-7281-1639-6
-
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 691-694; ISBN 978-1-7281-1639-6
-
2019,
Feng Z, Diao Y, Sun W, He Y, Leung PSW
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 48-51; ISBN 978-1-7281-1639-6
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2019,
Laakso I, Lehtinen T
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 334-337; ISBN 978-1-7281-1639-6
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2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Barcelona, Spain. IEEE: pp. 82-87; ISBN 978-1-7281-0595-6
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2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Barcelona, Spain. IEEE: pp. 1020-1024; ISBN 978-1-7281-0595-6
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2019,
Gryz K, Karpowicz J
2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Barcelona, Spain. IEEE: pp. 1030-1033; ISBN 978-1-7281-0595-6
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2019,
Alilou O, Grange F, Abdelli N, Journet S, Ribeiro J, Kouassi A, Maniscalco C, Machet A
2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Barcelona, Spain. IEEE: pp. 1034-1038; ISBN 978-1-7281-0595-6