By:
Sasaki K, Li K, Wake K, Watanabe S, Higashiyama J, Onishi T
Published in: 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE, 2019: pp. 43-46; ISBN 978-1-7281-1639-6