By:
Gomez-Tames J, Rashed E, Hirata A, Tarnaud T, Tanghe E, Van de Steene T, Martens L, Joseph W
Published in: 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE, 2019: pp. 162-165; ISBN 978-1-7281-1639-6