By:
Le DT, Li K, Watanabe S, Onishi T
Published in: 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE, 2019: pp. 78-81; ISBN 978-1-7281-1639-6