By:
He Y, Leung PSW, Chow Y, Diao Y
Published in: 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE, 2019: pp. 750-753; ISBN 978-1-7281-1639-6
