The following terms were included:
Magnetfeld, MF, "magnetic field", 磁界
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2019,
Sokolov AY, Lyubashina OA, Vaganova YS, Amelin AV
Zh Nevrol Psikhiatr Im S S Korsakova 119 (10): 79-88
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Curr Biol 29 (23): R1224-R1226
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2019,
Schramm S, Albers L, Ille S, Schröder A, Meyer B, Sollmann N, Krieg SM
Sci Rep 9: 17744
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J Chem Phys 151 (20): 204101
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2019,
Lorenzo MF, Thomas SC, Kani Y, Hinckley J, Lee M, Adler J, Verbridge SS, Hsu FC, Robertson JL, Davalos RV, Rossmeisl Jr JH
Cancers 11 (12): E1850
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2019,
Rathebe PC, Modisane DS, Rampedi MB, Biddesay-Manila S, Mbonane TP
2019 Open Innovations (OI), Cape Town, South Africa. IEEE: pp. 219-221; ISBN 978-1-7281-3465-9
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2019 Open Innovations (OI), Cape Town, South Africa. IEEE: pp. 222-225; ISBN 978-1-7281-3465-9
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2019,
Viorica V, Mircea-Emilian A, Paul N, Florel R
2019 International Conference on Electromechanical and Energy Systems (SIELMEN), Craiova, Romania. IEEE: pp. 1-5; ISBN 978-1-7281-4012-4
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2019,
Ionescu V, Săpunaru A, Popescu MO, Popescu CL
2019 IEEE PES Innovative Smart Grid Technologies Europe (ISGT-Europe), Bucharest, Romania. IEEE: pp. 1-5; ISBN 978-1-5386-8219-7
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2019,
Bejenaru O, Lunca E, David V
2019 International Conference on Electromechanical and Energy Systems (SIELMEN), Craiova, Romania. IEEE: pp. 1-4; ISBN 978-1-7281-4012-4
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2019,
Škiljo M, Blažević Z, Poljak D
2019 International Conference on Software, Telecommunications and Computer Networks (SoftCOM), Split, Croatia. IEEE: pp. 1-5; ISBN 978-1-7281-3711-7
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2019,
Bailey WH, Bodemann R, Bushberg J, Chou CK, Cleveland R, Faraone A, Foster KR, Gettman KE, Graf K, Harrington T, Hirata A, Kavet R, Keshvari J, Klauenberg BJ, Legros A, Maxson DP, Osepchuk JM, Reilly JP, Tell RA, Thansandote A, Yamazaki K, Ziskin MC, Zollman PM
IEEE Access 7: 171346-171356
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2019,
Houston BJ, Nixon B, McEwan KE, Martin JH, King BV, Aitken RJ, De Iuliis GN
Sci Rep 9: 17478
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2019,
Li H, Liu S, Yang X, Du Y, Luo J, Tan J, Sun Y
Int J Mol Sci 20 (23): E5847
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Federal Office for Radiation Protection (BfS),
Ressortforschungsberichte zur kerntechnischen Sicherheit und zum Strahlenschutz, BfS-RESFOR-154/19: 1-94
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2019,
Burke MJ, Kaptchuk TJ, Pascual-Leone A
Ann Neurol 85 (1): 12-20
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2019,
Xu J, Liu K, Chen T, Zhan T, Ouyang Z, Wang Y, Liu W, Zhang X, Sun Y, Xu G, Wang X
Aging 11 (22): 10385-10408
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2019,
Ehnert S, Schröter S, Aspera-Werz RH, Eisler W, Falldorf K, Ronniger M, Nussler AK
J Clin Med 8 (12): E2028
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2019,
Nielsen C, Solov'yov IA
J Chem Phys 151 (19): 194105
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2019,
Zebhauser PT, Vernet M, Unterburger E, Brem AK
Neuropsychol Rev 29 (4): 397-420
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2019,
Ji GJ, Wei JJ, Liu T, Li D, Zhu C, Yu F, Tian Y, Wang K, Zhang L, Hu P
Front Neurosci 13: 1155
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2019,
Scarfì MR, Mattsson MO, Simkó M, Zeni O
Int J Environ Res Public Health 16 (22): E4548
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2019,
Ziegler P, Nussler AK, Wilbrand B, Falldorf K, Springer F, Fentz AK, Eschenburg G, Ziegler A, Stöckle U, Maurer E, Ateschrang A, Schröter S, Ehnert S
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2019,
Borrione L, Brunoni AR
Braz J Psychiatry 41 (5): 376-377
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2019,
Hassanzahraee M, Zoghi M, Jaberzadeh S
Brain Connect 9 (10): 770-776
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2019,
Sekiba Y, Yamazaki K
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 83-86; ISBN 978-1-7281-1639-6
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2019,
Gomez-Tames J, Rashed E, Hirata A, Tarnaud T, Tanghe E, Van de Steene T, Martens L, Joseph W
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 162-165; ISBN 978-1-7281-1639-6
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[2019 Medical Technologies Congress (TIPTEKNO)], Izmir, Turkey. IEEE: pp. 1-4; ISBN 978-1-7281-2421-6
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2019,
Jamshed MA, Amjad O, Heliot F, Brown T
2019 IEEE Wireless Communications and Networking Conference Workshop (WCNCW), Marrakech, Morocco. IEEE: pp. 1-5; ISBN 978-1-7281-0923-7
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2019,
D'Anci KE, Uhl S, Oristaglio J, Sullivan N, Tsou AY
Ann Intern Med 171 (12): 906-915
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J Drugs Dermatol 18 (11): 1098-1102
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2019,
Ho SY, Chen IC, Chen YJ, Lee CH, Fu CM, Liu FC, Liou HH
Stem Cells Int 2019: 8790176
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2019,
Azizi SMY, Hosseini Sarghein S, Majd A, Peyvandi M
Physiol Mol Biol Plants 25 (6): 1445-1456
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2019,
Nimpf S, Nordmann GC, Kagerbauer D, Malkemper EP, Landler L, Papadaki-Anastasopoulou A, Ushakova L, Wenninger-Weinzierl A, Novatchkova M, Vincent P, Lendl T, Colombini M, Mason MJ, Keays DA
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2019,
Bodemann R, Finke J, von Freeden J, Gritsch T, Heinrich H, Hoffmann M, Jeschke P, Joosten S, Krischek R, Reidenbach HD, Schiessl K, Schreiber M, Schühle E, Storch D, Stunder D
Fachverband für Strahlenschutz e. V. (FS),
FS-2019-180-AKNIR: 1-111
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2019,
Makarov S, Horner M, Noetscher G
Springer International Publishing, Cham (Schweiz); ISBN 978-3-030-21292-6
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2019,
Rahayu Y, Hilmi MF, Masdar H
2019 16th International Conference on Quality in Research (QIR): International Symposium on Electrical and Computer Engineering, Padang, Indonesia. IEEE: pp. 1-5; ISBN 978-1-7281-1899-4
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2019,
Feng X, Chen X, Wang Y, Wang J
2019 8th International Symposium on Next Generation Electronics (ISNE), Zhengzhou, China. IEEE: pp. 1-3; ISBN 978-1-7281-2063-8
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2019,
Sasaki K, Li K, Wake K, Watanabe S, Higashiyama J, Onishi T
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 43-46; ISBN 978-1-7281-1639-6
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2019,
Miwa K, Takenaka T, Hirata A
IEEE Trans Electromagn Compat 61 (6): 2024-2030
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2019,
Zachepa N, Chorna O, Rieznik D
2019 IEEE International Conference on Modern Electrical and Energy Systems (MEES), Kremenchuk, Ukraine. IEEE: pp. 158-161; ISBN 978-1-7281-2570-1
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2019,
Rieznik D, Zachepa I, Zachepa N, Sukach S, Chenchevoi V, Vovna O
2019 IEEE International Conference on Modern Electrical and Energy Systems (MEES), Kremenchuk, Ukraine. IEEE: pp. 198-201; ISBN 978-1-7281-2570-1
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2019,
Phaneuf M, Mojabi P
2019 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, Atlanta, GA, USA. IEEE: pp. 533-534; ISBN 978-1-7281-0693-9
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2019,
Shiina T, Yamazaki K
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 744-747; ISBN 978-1-7281-1639-6
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2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 166-169; ISBN 978-1-7281-1639-6
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2019,
He Y, Leung PSW, Chow Y, Diao Y
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 750-753; ISBN 978-1-7281-1639-6
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2019,
Ahmed S, Mehmood A, Sydänheimo L, Ukkonen L, Björninen T
2019 IEEE International Conference on RFID Technology and Applications (RFID-TA), Pisa, Italy. IEEE: pp. 231-235; ISBN 978-1-7281-0590-1
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2019,
Feng Z, Diao Y, Sun W, He Y, Leung PSW
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 48-51; ISBN 978-1-7281-1639-6
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2019,
Laakso I, Lehtinen T
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 334-337; ISBN 978-1-7281-1639-6
