The following terms were included:
電磁両立性, "elektromagnetische Verträglichkeit", EMC, EMV, "electromagnetic compatibility"
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2018,
Piper S, Ball L, Mandziuk M
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI), Long Beach, CA, USA. IEEE: pp. 448-453; ISBN 978-1-5386-6622-7
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2018,
Bejenaru O, Lazarescu C, Vornicu S, David V
2018 International Conference and Exposition on Electrical And Power Engineering (EPE), Iasi, Romania. IEEE: pp. 1004-1009; ISBN 978-1-5386-5063-9
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2018,
Rathebe PC, Mbonane TP
2018 IEEE 4th Global Electromagnetic Compatibility Conference (GEMCCON), Stellenbosch, South Africa. IEEE: pp. 1-3; ISBN 978-1-5386-5729-4
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2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: pp. 959-962; ISBN 978-1-5090-3955-5
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2018,
Kim JH, Kim H, Nam S
2018 International Symposium on Antennas and Propagation (ISAP), Busan, Korea (South). IEEE: pp. 1-2; ISBN 978-1-5386-5389-0
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2018,
Houran MA, Yang X, Chen W, Samizadeh M
2018 International Power Electronics Conference (IPEC-Niigata 2018 -ECCE Asia), Niigata, Japan. IEEE: pp. 1062-1066; ISBN 978-1-5386-4190-3
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2018,
He W, Gao Z, Zhang W
Zhongguo Yi Liao Qi Xie Za Zhi 42 (5): 372-374
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2018,
Kurta E, Kovačević Ž, Gurbeta L, Badnjević A
2018 7th Mediterranean Conference on Embedded Computing (MECO), Budva, Montenegro. IEEE: pp. 1-4; ISBN 978-1-5386-5684-6
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2018,
Kosterec M, Kurimský J, Vargová B
2018 19th International Scientific Conference on Electric Power Engineering (EPE), Brno, Czech Republic. IEEE: pp. 1-6; ISBN 978-1-5386-4613-7
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2018,
Douglas MG, Pfeifer S, Kuehn S, Neufeld E, Pokovic K, Carrasco E, Samaras T, Christ A, Capstick M, Kuster N
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: pp. 92-94; ISBN 978-1-5090-3955-5
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2018,
Fukui S, Maeda N, Xiao F, Kami Y
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: pp. 331-335; ISBN 978-1-5090-3955-5
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2018,
Munhoz-Rojas PE, Segura-Salas CS, Costa AA, Martins R, Hoffmann-Neto J
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: pp. 1267-1273; ISBN 978-1-5090-3955-5
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2018,
Sun W, He Y, Diao Y, Leung SW, Siu YM, Kong YC
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: pp. 872-874; ISBN 978-1-5090-3955-5
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2018,
He Y, Sun W, Leung PSW, Siu TYM, Ng KT
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: pp. 936-939; ISBN 978-1-5090-3955-5
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2018,
Koh WJ, Moochhala SM
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: pp. 518-522; ISBN 978-1-5090-3955-5
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2018,
Vargová B, Majláth I, Kurimský J, Cimbala R, Kosterec M, Tryjanowski P, Jankowiak Ł, Raši T, Majláthová V
Exp Appl Acarol 75 (1): 85-95
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2018,
Zhang K, Du L, Zhu Z, Song B, Xu D
IEEE Trans Electromagn Compat 60 (4): 829 - 839
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2018,
Gomez-Tames J, Laakso I, Haba Y, Hirata A, Poljak D, Yamazaki K
IEEE Trans Electromagn Compat 60 (3): 589 - 597
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2018,
Poljak D, Cvetković M, Bottauscio O, Hirata A, Laakso I, Neufeld E, Reboux S, Warren C, Giannopolous A, Costen F
IEEE Trans Electromagn Compat 60 (2): 328 - 337
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2017,
Campi T, Cruciani S, Maradei F, Feliziani M
IEEE Trans Electromagn Compat 59 (2): 686-694
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2017,
Jin L, Peng C, Jiang T
IEEE Trans Electromagn Compat 59 (4): 1095-1102
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2017,
Vargova B, Kurimsky J, Cimbala R, Kosterec M, Majlath I, Pipova N, Tryjanowski P, Jankowiak L, Majlathova V
Syst Appl Acarol 22 (5): 683-693
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2017,
Bulut F, Efendioglu HS, Solak V, Yabuloglu M, Özer H
2017 IV International Electromagnetic Compatibility Conference (EMC Turkiye), Ankara, Turkey. IEEE, Ankara, Turkey: pp. 1-3; ISBN 978-1-5090-4821-2
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2017,
Rumeng T, Senwen L, Tong W, Shaochuan C
2017 IEEE 5th International Symposium on Electromagnetic Compatibility (EMC-Beijing), Beijing, China. IEEE: pp. 1-5; ISBN 978-1-5090-5186-1
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2017,
Park J, Kim D, Hwang K, Park HH, Kwak SI, Kwon JH, Ahn S
IEEE Trans Electromagn Compat 59 (2): 695 - 703
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2017,
Masumnia-Bisheh K, Ghaffari-Miab M, Zakeri B
IEEE Trans Electromagn Compat 59 (2): 509 - 517
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2017,
Yavolovskaya E, Gabriadze G, Chiqovani G, Jobava R
2017 XXIInd International Seminar/Workshop on Direct and Inverse Problems of Electromagnetic and Acoustic Wave Theory (DIPED), Dnipro, Ukraine. IEEE: pp. 183-186; ISBN 978-1-5090-0605-2
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2017,
Gercek C, Magne I, Kourtiche D, Schmitt P, Roth P, Nadi M, Souques M
2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Angers, France. IEEE: pp. 1-5; ISBN 978-1-5386-0689-6
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2017,
Campi T, Cruciani S, De Santis V, Maradei F, Feliziani M
2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Angers, France. IEEE: pp. 1-6; ISBN 978-1-5386-0689-6
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2017,
Campi T, Cruciani S, De Santis V, Maradei F, Feliziani M
2017 International Conference of Electrical and Electronic Technologies for Automotive, Turin, Italy. IEEE: pp. 1-4; ISBN 978-1-5090-6006-1
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2017,
Paganoto PS, Hagedorn MP, da Silva JR
2017 IEEE 3rd Global Electromagnetic Compatibility Conference (GEMCCON), Sao Paulo, Brazil. IEEE: pp. 1-5; ISBN 978-1-5386-2992-5
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2017,
Park BS, Razjouyan A, Angelone LM, McCright B, Rajan SS
IEEE Trans Electromagn Compat 59 (5): 1390-1399
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2017 IEEE Conference on Antenna Measurements & Applications (CAMA), Tsukuba, Japan. IEEE, Tsukuba, Japan: pp. 142-143; ISBN 978-1-5090-5029-1
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2017,
Shi J, Chakarothai J, Wang J, Wake K, Fujiwara O, Watanabe S
2017 IEEE 5th International Symposium on Electromagnetic Compatibility (EMC-Beijing), Beijing, China. IEEE; ISBN 978-1-5090-5186-1
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Elektromagnetische Verträglichkeit in der Kfz-Technik: Beiträge der 7. GMM-Fachtagung, 2017. VDE/VDI-Gesellschaft Mikroelektronik Mikrosystem- und Feinwerktechnik (GMM): pp. 23-28; ISBN 978-3-8007-4460-2
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2017,
Bärenfänger J, Cuartielles D, Kürschner D, Maarleveld M
Elektromagnetische Verträglichkeit in der Kfz-Technik: Beiträge der 7. GMM-Fachtagung, 2017. VDE/VDI-Gesellschaft Mikroelektronik Mikrosystem- und Feinwerktechnik (GMM): pp. 7-16; ISBN 978-3-8007-4460-2
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2017,
Putro EM, Sulistya B, Septiawan R, Rufiyanto A, Trihatmo S, Hamidah M
2017 International Conference on Control, Electronics, Renewable Energy and Communications (ICCREC), Yogyakarta, Indonesia. IEEE; ISBN 978-1-5386-2746-4
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2017,
Yavolovskaya E, Willmann B, Gabriadze G, Chiqovani G, Sukhiashvili Z, Iosava S, Svanidze L, Jobava R
2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Angers, France. IEEE; ISBN 978-1-5386-0689-6
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2017,
De Miguel-Bilbao S, Blas J, Aguirre E, Iturri PL, Azpilicueta L, Falcone F, Ramos V
2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Angers, France. IEEE; ISBN 978-1-5386-0689-6
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2017,
Kurnaz C, Engiz BK, Turgut A
2017 IV International Electromagnetic Compatibility Conference (EMC Turkiye), Ankara, Turkey. IEEE, Ankara, Turkey; ISBN 978-1-5090-4821-2
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2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Angers, France. IEEE; ISBN 978-1-5386-0689-6
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2017,
Jomaa K, Ndagijimana F, Ayad H, Fadlallah M, Jomaah J
2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Angers, France. IEEE; ISBN 978-1-5386-0689-6
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2017,
Gabriadze G, Chiqovani G, Yavolovskaya E, Svanidze L, Karkashadze D, Jobava R
2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Angers, France. IEEE; ISBN 978-1-5386-0689-6
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2017,
Karpowicz J, De Miguel-Bilbao S, Ramos V, Falcone F, Gryz K, Leszko W, Zradziński P
2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Angers, France. IEEE; ISBN 978-1-5386-0689-6
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2017,
Sun W, He Y, Diao Y, Leung SW, Siu YM, Kong RYC, Lo WK
2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Angers, France. IEEE; ISBN 978-1-5386-0689-6
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2017,
Yang R, Zheng J, Chen J, Kainz W
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Washington, DC, USA. IEEE; ISBN 978-1-5386-2232-2
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2017,
Oganezova I, Pommerenke D, Zhou J, Ghosh K, Hosseinbeig A, Lee J, Tsitskishvili N
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Washington, DC, USA. IEEE; ISBN 978-1-5386-2232-2
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2017,
Dürrenberger G, Leuchtmann P, Röösli M, Siegrist M, Sütterlin B
Swiss Federal Office of Energy (SFOE),
1-125
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2017,
Hikage T, Yamagishi M, Shindo K, Nojima T
2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Seoul, Korea (South). IEEE; ISBN 978-1-5386-3913-9
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2017,
Sun W, He Y, Diao Y, Leung SW, Siu YM, Kong R
2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Seoul, Korea (South). IEEE; ISBN 978-1-5386-3913-9