By:
Sun W, He Y, Diao Y, Leung SW, Siu YM, Kong YC
Published in: 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE, 2018: pp. 872-874; ISBN 978-1-5090-3955-5
