By:
Douglas MG, Pfeifer S, Kuehn S, Neufeld E, Pokovic K, Carrasco E, Samaras T, Christ A, Capstick M, Kuster N
Published in: 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE, 2018: pp. 92-94; ISBN 978-1-5090-3955-5
