By:
He Y, Sun W, Leung PSW, Siu TYM, Ng KT
Published in: 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE, 2018: pp. 936-939; ISBN 978-1-5090-3955-5
