The following terms were included:
"elektromagnetische Verträglichkeit", EMC, EMV, "electromagnetic compatibility", 電磁両立性
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2019,
Willmann B, Rabe H, Leugers C, Sassi O, Waldera C, Vick R
2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Barcelona, Spain. IEEE: 513-517; ISBN 978-1-7281-0595-6
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2019,
Gomez-Tames J, Tarnaud T, Miwa K, Hirata A, Van de Steene T, Martens L, Tanghe E, Joseph W
IEEE Trans Electromagn Compat 61 (6): 1944 - 1952
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German Commission on Radiological Protection (SSK),
1-45
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2019,
Grazian F, Shi W, Dong J, van Duijsen P, Soeiro TB, Bauer P
2019 AEIT International Conference of Electrical and Electronic Technologies for Automotive (AEIT AUTOMOTIVE), Torino, Italy. IEEE: 1-5; ISBN 978-1-7281-3278-5
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2019,
Lagouanelle P, Krauth VL, Pichon L
2019 AEIT International Conference of Electrical and Electronic Technologies for Automotive (AEIT AUTOMOTIVE), Torino, Italy. IEEE: 1-5; ISBN 978-1-7281-3278-5
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2019,
Klos-Witkowska A, Martsenyuk V, Karpinski M, Obeidat I
2019 Advances in Science and Engineering Technology International Conferences (ASET), Dubai, United Arab Emirates. IEEE: 1-5; ISBN 978-1-5386-8272-2
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2019,
Rathebe PC, Mbonane TP
2018 IEEE 4th Global Electromagnetic Compatibility Conference (GEMCCON), Stellenbosch, South Africa. IEEE: 1-3; ISBN 978-1-5386-5729-4
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2019,
Nefzi A, Lemercier CE, El Khoueiry C, Lewis N, Lagroye I, Boucsein C, Leveque P, Arnaud-Cormos D
2019 IEEE MTT-S International Microwave Biomedical Conference (IMBioC), Nanjing, China. IEEE: 1-3; ISBN 978-1-5386-7396-6
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2019,
Li X, Zhu F, Lu H, Qiu R, Tang Y
IEEE Trans Electromagn Compat 61 (2): 319 - 326
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2019,
Atefi SR, Serano P, Poulsen C, Angelone LM, Bonmassar G
IEEE Trans Electromagn Compat 61 (3): 852-859
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2019 11th International Symposium on Advanced Topics in Electrical Engineering (ATEE), Bucharest, Romania. IEEE: 1-5; ISBN 978-1-7281-0102-6
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2019,
Campi T, Cruciani S, Maradei F, Feliziani M
IEEE Trans Electromagn Compat 61 (6): 1935 - 1943
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2019,
Zhou Y, Zhang W, Yu H
Zhongguo Yi Liao Qi Xie Za Zhi 43 (2): 94-98
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2019,
Omi S, Uno T, Arima T, Wiart J
IEEE Trans Electromagn Compat 61 (1): 48 - 56
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2019,
Yang R, Zheng J, Wang Y, Guo R, Kainz W, Chen J
IEEE Trans Electromagn Compat 61 (6): 1726 - 1732
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2019,
Ji X, Zheng J, Yang R, Kainz W, Chen J
IEEE Trans Electromagn Compat 61 (1): 57 - 64
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2019,
Wang Q, Li W, Kang J, Wang Y
IEEE Trans Electromagn Compat 61 (6): 1913 - 1925
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2019,
Trigui A, Hached S, Ammari AC, Savaria Y, Sawan M
IEEE Rev Biomed Eng 12: 72-87
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2019,
Pfeifer S, Carrasco E, Crespo-Valero P, Neufeld E, Kühn S, Samaras T, Christ A, Capstick MH, Kuster N
IEEE Trans Electromagn Compat 61 (2): 476 - 486
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2019,
Xu B, Gustafsson M, Shi S, Zhao K, Ying Z, He S
IEEE Trans Electromagn Compat 61 (2): 327 - 336
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2019,
Ängskog P, Bäckström M, Samuelsson C, Kangashaka Vallhagen B
IEEE Trans Electromagn Compat 61 (3): 870 - 877
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2019,
Wang J, Li Q, Cai L, Zhou M, Xiao J, Šunjerga A
IEEE Trans Electromagn Compat 61 (2): 440 - 448
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2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands. IEEE: 184-189; ISBN 978-1-4673-9699-8
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2018,
Monti G, Masotti D, Paolini G, Corchia L, Costanzo A, Dionigi M, Mastri F, Mongiardo M, Sorrentino R, Tarricone L
IEEE Electromagn Compat Mag 7 (1): 67-77
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2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI), Long Beach, CA, USA. IEEE: 187-192; ISBN 978-1-5386-6622-7
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2018 IEEE International Symposium on Antennas and Propagation & USNC/URSI National Radio Science Meeting, Boston, MA, USA. IEEE: 783-784; ISBN 978-1-5386-7103-0
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2018,
Mengjun W, Jun Z, Hongxing Z, Mengjun W, Lulu C, Ze Y, Ping M, Hongxing Z
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 981-985; ISBN 978-1-5090-3955-5
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IEEE Electromagn Compat Mag 7 (1): 78-86
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2018 International Conference and Exposition on Electrical And Power Engineering (EPE), Iasi, Romania. IEEE: 693-696; ISBN 978-1-5386-5063-9
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2018,
Drandić A, Trkulja B
Engineering Analysis with Boundary Elements 91: 1-6
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2018,
Zeng X, Ma H, Pi C, Yang P, Yan S, Yuan S, Shi J, Zhang Y, Ma L, Pang S
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 24-27; ISBN 978-1-5090-3955-5
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2018,
Zradzinski P, Karpowicz J, Gryz K, Leszko W
Eskola H, Väisänen O, Viik J, Hyttinen J (eds.): EMBEC & NBC 2017: Joint Conference of the European Medical and Biological Engineering Conference (EMBEC) and the Nordic-Baltic Conference on Biomedical Engineering and Medical Physics (NBC), Tampere, Finland, June 2017. IFMBE Proceedings, volume 65; Springer, Singapore; 1008-1011; ISBN 978-981-10-5121-0
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River Publishers Series in Communications; Shinohara N (ed.): River Publishers, Gistrup, Denmark; ISBN 978-87-93609-24-2
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2018,
Chen J, Ruddle AR, Xian Teo Y
2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands. IEEE: 860-865; ISBN 978-1-4673-9699-8
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2018,
Kaschel H, Ahumada C
2018 IEEE International Conference on Automation/XXIII Congress of the Chilean Association of Automatic Control (ICA-ACCA), Concepcion, Chile. IEEE: 1-8; ISBN 978-1-5386-5587-0
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2018,
Kaschel H, Ahumada C
2018 IEEE International Conference on Automation/XXIII Congress of the Chilean Association of Automatic Control (ICA-ACCA), Concepcion, Chile. IEEE: 1-6; ISBN 978-1-5386-5587-0
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2018,
Ardeleanu ME, Nicoleanu P, Stanescu DG, Pisleag D
2018 International Conference on Applied and Theoretical Electricity (ICATE), Craiova, Romania. IEEE: 1-6; ISBN 978-1-5386-3807-1
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2018,
Aga K, Hirata A, Laakso I
2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands. IEEE: 515-520; ISBN 978-1-4673-9699-8
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2018,
Karpowicz J, De Miguel-Bilbao S, Zradzńnski P, Gryz K, Falcone F, Ramos V
2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands. IEEE: 972-975; ISBN 978-1-4673-9699-8
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2018,
Isrie S, Moonen N, Schipper H, Bergsma H, Lefcrink F
2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands. IEEE: 500-505; ISBN 978-1-4673-9699-8
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2018,
Feliziani M, Campi T, Cruciani S, De Santis V
2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands. IEEE: 155-160; ISBN 978-1-4673-9699-8
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2018,
Buesink F, Vout-Ardatjew R, Leferink L
2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands. IEEE: 918-921; ISBN 978-1-4673-9699-8
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2018,
De Miguel-Bilbao S, Blas J, Falcone F, Ramos V
2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands. IEEE: 510-514; ISBN 978-1-4673-9699-8
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2018,
Sadamitsu S, Leung SW, Lo WK, Sun WN
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 28-31; ISBN 978-1-5090-3955-5
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2018,
Sato K, Tsukahara T, Kamimura Y
2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands. IEEE: 506-509; ISBN 978-1-4673-9699-8
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2018,
Kamimura Y, Inagaki S, Wake K
2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands. IEEE: 855-859; ISBN 978-1-4673-9699-8
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2018,
Piper S, Ball L, Mandziuk M
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI), Long Beach, CA, USA. IEEE: 448-453; ISBN 978-1-5386-6622-7
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2018,
Bejenaru O, Lazarescu C, Vornicu S, David V
2018 International Conference and Exposition on Electrical And Power Engineering (EPE), Iasi, Romania. IEEE: 1004-1009; ISBN 978-1-5386-5063-9
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2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 959-962; ISBN 978-1-5090-3955-5
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2018,
Kim JH, Kim H, Nam S
2018 International Symposium on Antennas and Propagation (ISAP), Busan, Korea (South). IEEE: 1-2; ISBN 978-1-5386-5389-0