By:
Zeng X, Ma H, Pi C, Yang P, Yan S, Yuan S, Shi J, Zhang Y, Ma L, Pang S
Published in: 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE, 2018: pp. 24-27; ISBN 978-1-5090-3955-5
