By:
Mengjun W, Jun Z, Hongxing Z, Mengjun W, Lulu C, Ze Y, Ping M, Hongxing Z
Published in: 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE, 2018: pp. 981-985; ISBN 978-1-5090-3955-5
