By:
Sadamitsu S, Leung SW, Lo WK, Sun WN
Published in: 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE, 2018: pp. 28-31; ISBN 978-1-5090-3955-5
