The following terms were included:
induction, induktives, Induktion, 誘導
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2019,
He Y, Leung PSW, Chow Y, Diao Y
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 750-753; ISBN 978-1-7281-1639-6
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2019,
Feng Z, Diao Y, Sun W, He Y, Leung PSW
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 48-51; ISBN 978-1-7281-1639-6
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2019,
Laakso I, Lehtinen T
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 334-337; ISBN 978-1-7281-1639-6
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2019,
Kubo K, Sakamoto J, Honda A, Honda Y, Kataoka H, Nakano J, Okita M
Am J Phys Med Rehabil 98 (2): 147-153
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2019,
Rahman NAA, Jamil MMA, Adon MN
2019 IEEE 10th Control and System Graduate Research Colloquium (ICSGRC), Shah Alam, Malaysia. IEEE: pp. 100-103; ISBN 978-1-7281-0756-1
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2019,
Wen F, Li Q, Li R, Liu L, Wu T
2019 IEEE Innovative Smart Grid Technologies - Asia (ISGT Asia), Chengdu, China. IEEE: pp. 4117-4121; ISBN 978-1-7281-3521-2
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2019,
Campi T, Cruciani S, Maradei F, Feliziani M
2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Barcelona, Spain. IEEE: pp. 1116-1121; ISBN 978-1-7281-0595-6
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2019,
Balmer C, Gass M, Dave H, Duru F, Luechinger R
J Interv Card Electrophysiol 56 (3): 321-326
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2019,
Hough CM, Purschke DN, Huang C, Titova LV, Kovalchuk O, Warkentin BJ, Hegmann FA
2019 44th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz), Paris, France. IEEE: pp. 1-3; ISBN 978-1-5386-8286-9
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2019,
Dufor T, Grehl S, Tang AD, Doulazmi M, Traoré M, Debray N, Dubacq C, Deng ZD, Mariani J, Lohof AM, Sherrard RM
Sci Adv 5 (10): eaav9847