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2019,
Liu B, Ouyang Z, Li P, Qu Y, Wu T, Wei Z
2019 22nd International Conference on Electrical Machines and Systems (ICEMS), Harbin, China. IEEE: pp. 1-5; ISBN 978-1-7281-3399-7
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2019,
Abufadda M, Erdélyi A, Krizsán G, Hebling J, Fülöp JA, Molnár L
2019 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC), Munich, Germany. IEEE: p. 1; ISBN 978-1-7281-0470-6
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2019,
Ibrahim AU, Zhong W, Cui H, Li H, Xu D
2019 IEEE Energy Conversion Congress and Exposition (ECCE), Baltimore, MD, USA. IEEE: pp. 4575-4579; ISBN 978-1-7281-0396-9
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2019,
Mohammad M, Pries J, Onar O, Anwar S, Galigekere VP, Su GJ, Wilkins J
2019 IEEE Energy Conversion Congress and Exposition (ECCE), Baltimore, MD, USA. IEEE: pp. 5733-5739; ISBN 978-1-7281-0396-9
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2019,
Zortea M, Ramalho L, Alves RL, Alves CFDS, Braulio G, Torres ILDS, Fregni F, Caumo W
Front Neurosci 13: 1218
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2019,
Ahn HM, Ham BJ, Kim SH
Front Psychiatry 10: 815
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2019,
Etoh S, Kawamura K, Tomonaga K, Miura S, Harada S, Noma T, Kikuno S, Ueno M, Miyata R, Shimodozono M
NeuroRehabilitation 45 (3): 323-329
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2019,
Tumkaya L, Yilmaz A, Akyildiz K, Mercantepe T, Yazici ZA, Yilmaz H
Cells Tissues Organs 207 (3-4): 187-196
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2019,
Michalowska J, Jozwik J, Tofil A
2019 IEEE 5th International Workshop on Metrology for AeroSpace (MetroAeroSpace), Torino, Italy. IEEE: pp. 366-370; ISBN 978-1-7281-1345-6
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2019,
Polat LNÖ, Özen S, Ates K, Keskin HI
2019 Medical Technologies Congress (TIPTEKNO), Izmir, Turkey. IEEE: pp. 1-4; ISBN 978-1-7281-2421-6
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2019,
Piroddi A, Torregiani M
2019 International Conference on Electromagnetics in Advanced Applications (ICEAA), Granada, Spain. IEEE: pp. 1409-1414; ISBN 978-1-7281-0564-2
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2019,
Zhang L, Nie Q, Sun X
NeuroReport 30 (8): 550-555
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2019,
Akkaya R, Gümüş E, Akkaya B, Karabulut S, Gülmez K, Karademir M, Taştemur Y, Taşkıran AŞ
Pathophysiology 26 (3-4): 375-379
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2019,
Aboud T, Schuster NM
Curr Treat Options Neurol 21 (12): 62
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2019,
Rathebe PC, Modisane DS, Rampedi MB, Biddesay-Manila S, Mbonane TP
2019 Open Innovations (OI), Cape Town, South Africa. IEEE: pp. 219-221; ISBN 978-1-7281-3465-9
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2019 Open Innovations (OI), Cape Town, South Africa. IEEE: pp. 222-225; ISBN 978-1-7281-3465-9
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2019,
Bejenaru O, Lazarescu C, Salceanu A, David V
2019 International Conference on Electromechanical and Energy Systems (SIELMEN), Craiova, Romania. IEEE: pp. 1-5; ISBN 978-1-7281-4012-4
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2019,
Ionescu V, Săpunaru A, Popescu MO, Popescu CL
2019 IEEE PES Innovative Smart Grid Technologies Europe (ISGT-Europe), Bucharest, Romania. IEEE: pp. 1-5; ISBN 978-1-5386-8219-7
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2019,
Matković A, Šarolić A
2019 International Conference on Software, Telecommunications and Computer Networks (SoftCOM), Split, Croatia. IEEE: pp. 1-4; ISBN 978-1-7281-3711-7
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2019,
Bejenaru O, Lunca E, David V
2019 International Conference on Electromechanical and Energy Systems (SIELMEN), Craiova, Romania. IEEE: pp. 1-4; ISBN 978-1-7281-4012-4
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2019,
Škiljo M, Blažević Z, Poljak D
2019 International Conference on Software, Telecommunications and Computer Networks (SoftCOM), Split, Croatia. IEEE: pp. 1-5; ISBN 978-1-7281-3711-7
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2019,
Bailey WH, Bodemann R, Bushberg J, Chou CK, Cleveland R, Faraone A, Foster KR, Gettman KE, Graf K, Harrington T, Hirata A, Kavet R, Keshvari J, Klauenberg BJ, Legros A, Maxson DP, Osepchuk JM, Reilly JP, Tell RA, Thansandote A, Yamazaki K, Ziskin MC, Zollman PM
IEEE Access 7: 171346-171356
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2019,
Werner R, Knipe P, Iskra S
IEEE Access 7: 170682-170689
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2019,
Fernández-Rodríguez C, Bulla G, de Salles AA
2019 49th European Microwave Conference (EuMC), Paris, France. IEEE: pp. 264-267; ISBN 978-1-7281-1798-0
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2019,
Houston BJ, Nixon B, McEwan KE, Martin JH, King BV, Aitken RJ, De Iuliis GN
Sci Rep 9: 17478
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2019,
Li H, Liu S, Yang X, Du Y, Luo J, Tan J, Sun Y
Int J Mol Sci 20 (23): E5847
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Federal Office for Radiation Protection (BfS),
Ressortforschungsberichte zur kerntechnischen Sicherheit und zum Strahlenschutz, BfS-RESFOR-154/19: 1-94
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2019,
Safari Variani A, Saboori S, Shahsavari S, Yari S, Zaroushani V
Asian Pac J Cancer Prev 20 (11): 3211-3219
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2019,
Xu J, Liu K, Chen T, Zhan T, Ouyang Z, Wang Y, Liu W, Zhang X, Sun Y, Xu G, Wang X
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2019,
Ehnert S, Schröter S, Aspera-Werz RH, Eisler W, Falldorf K, Ronniger M, Nussler AK
J Clin Med 8 (12): E2028
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2019,
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J Chem Phys 151 (19): 194105
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2019,
Visconti C, Mastroluca A, Varano L, Del Gaudio A
Eur Rev Med Pharmacol Sci 23 (4) Suppl: 27-34
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2019,
Scarfì MR, Mattsson MO, Simkó M, Zeni O
Int J Environ Res Public Health 16 (22): E4548
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2019,
Jadia S, Qureshi S, Jain L, Shringirishi M
Indian J Otolaryngol Head Neck Surg 71 Suppl 2: 1169-1173
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2019,
Said-Salman IH, Jebaii FA, Yusef HH, Moustafa ME
J Biomed Phys Eng 9 (5): 579-586
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2019,
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Oman Med J 34 (6): 544-552
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2019,
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2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 83-86; ISBN 978-1-7281-1639-6
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2019,
Gomez-Tames J, Rashed E, Hirata A, Tarnaud T, Tanghe E, Van de Steene T, Martens L, Joseph W
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 162-165; ISBN 978-1-7281-1639-6
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[2019 Medical Technologies Congress (TIPTEKNO)], Izmir, Turkey. IEEE: pp. 1-4; ISBN 978-1-7281-2421-6
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2019,
Jamshed MA, Amjad O, Heliot F, Brown T
2019 IEEE Wireless Communications and Networking Conference Workshop (WCNCW), Marrakech, Morocco. IEEE: pp. 1-5; ISBN 978-1-7281-0923-7
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2019,
D'Anci KE, Uhl S, Oristaglio J, Sullivan N, Tsou AY
Ann Intern Med 171 (12): 906-915
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2019,
Rubin AE, Usta OB, Schloss R, Yarmush M, Golberg A
Adv Wound Care 8 (4): 136-148
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2019,
Ho SY, Chen IC, Chen YJ, Lee CH, Fu CM, Liu FC, Liou HH
Stem Cells Int 2019: 8790176
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2019,
Azizi SMY, Hosseini Sarghein S, Majd A, Peyvandi M
Physiol Mol Biol Plants 25 (6): 1445-1456
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2019,
Nimpf S, Nordmann GC, Kagerbauer D, Malkemper EP, Landler L, Papadaki-Anastasopoulou A, Ushakova L, Wenninger-Weinzierl A, Novatchkova M, Vincent P, Lendl T, Colombini M, Mason MJ, Keays DA
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2019,
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Springer International Publishing, Cham (Schweiz); ISBN 978-3-030-21292-6
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2019,
Feng X, Chen X, Wang Y, Wang J
2019 8th International Symposium on Next Generation Electronics (ISNE), Zhengzhou, China. IEEE: pp. 1-3; ISBN 978-1-7281-2063-8
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2019,
Sasaki K, Li K, Wake K, Watanabe S, Higashiyama J, Onishi T
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 43-46; ISBN 978-1-7281-1639-6
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2019,
Zachepa N, Chorna O, Rieznik D
2019 IEEE International Conference on Modern Electrical and Energy Systems (MEES), Kremenchuk, Ukraine. IEEE: pp. 158-161; ISBN 978-1-7281-2570-1