The following terms were included:
electromagnetic, elektromagnetisch, 電磁気の
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2019,
Lin CY, Lee KM, Chen YL, Huang SC
2019 IEEE/ASME International Conference on Advanced Intelligent Mechatronics (AIM), Hong Kong, China. IEEE: pp. 1522-1527; ISBN 978-1-7281-2494-0
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2019,
Piroddi A, Torregiani M
2019 International Conference on Electromagnetics in Advanced Applications (ICEAA), Granada, Spain. IEEE: pp. 1409-1414; ISBN 978-1-7281-0564-2
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2019,
Zhang L, Nie Q, Sun X
NeuroReport 30 (8): 550-555
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2019,
Akkaya R, Gümüş E, Akkaya B, Karabulut S, Gülmez K, Karademir M, Taştemur Y, Taşkıran AŞ
Pathophysiology 26 (3-4): 375-379
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2019,
Mohsen S, Mahmoudian S, Talebian S, Pourbakht A
J Clin Neurosci 67: 178-184
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N Z Med J 132 (1506): 96-97
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2019,
Kasten FH, Duecker K, Maack MC, Meiser A, Herrmann CS
Nat Commun 10: 5427
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N Z Med J 132 (1506): 98-100
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2019,
Arnold CE, Rajnicek AM, Hoare JI, Pokharel SM, McCaig CD, Barker RN, Wilson HM
Sci Rep 9: 17604
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2019,
Rathebe PC, Modisane DS, Rampedi MB, Biddesay-Manila S, Mbonane TP
2019 Open Innovations (OI), Cape Town, South Africa. IEEE: pp. 219-221; ISBN 978-1-7281-3465-9
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2019 Open Innovations (OI), Cape Town, South Africa. IEEE: pp. 222-225; ISBN 978-1-7281-3465-9
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2019,
Bejenaru O, Lazarescu C, Salceanu A, David V
2019 International Conference on Electromechanical and Energy Systems (SIELMEN), Craiova, Romania. IEEE: pp. 1-5; ISBN 978-1-7281-4012-4
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2019,
Viorica V, Mircea-Emilian A, Paul N, Florel R
2019 International Conference on Electromechanical and Energy Systems (SIELMEN), Craiova, Romania. IEEE: pp. 1-5; ISBN 978-1-7281-4012-4
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2019,
Matković A, Šarolić A
2019 International Conference on Software, Telecommunications and Computer Networks (SoftCOM), Split, Croatia. IEEE: pp. 1-4; ISBN 978-1-7281-3711-7
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2019,
Bejenaru O, Lunca E, David V
2019 International Conference on Electromechanical and Energy Systems (SIELMEN), Craiova, Romania. IEEE: pp. 1-4; ISBN 978-1-7281-4012-4
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2019,
Škiljo M, Blažević Z, Poljak D
2019 International Conference on Software, Telecommunications and Computer Networks (SoftCOM), Split, Croatia. IEEE: pp. 1-5; ISBN 978-1-7281-3711-7
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2019,
Bailey WH, Bodemann R, Bushberg J, Chou CK, Cleveland R, Faraone A, Foster KR, Gettman KE, Graf K, Harrington T, Hirata A, Kavet R, Keshvari J, Klauenberg BJ, Legros A, Maxson DP, Osepchuk JM, Reilly JP, Tell RA, Thansandote A, Yamazaki K, Ziskin MC, Zollman PM
IEEE Access 7: 171346-171356
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2019,
Werner R, Knipe P, Iskra S
IEEE Access 7: 170682-170689
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2019,
Caramazza L, De Angelis A, Della Valle E, Denzi A, Nardoni M, Paolicelli P, Petralito S, Apollonio F, Liberti M
2019 49th European Microwave Conference (EuMC), Paris, France. IEEE: pp. 220-223; ISBN 978-1-7281-1798-0
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2019,
Asif SM, Iftikhar A, Farooq U, Hansen J, Striker R, Braaten BD, Ewert DL, Maile K
2019 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, Atlanta, GA, USA. IEEE: pp. 757-758; ISBN 978-1-7281-0693-9
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2019,
Houston BJ, Nixon B, McEwan KE, Martin JH, King BV, Aitken RJ, De Iuliis GN
Sci Rep 9: 17478
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2019,
Li H, Liu S, Yang X, Du Y, Luo J, Tan J, Sun Y
Int J Mol Sci 20 (23): E5847
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2019,
Ehnert S, Schröter S, Aspera-Werz RH, Eisler W, Falldorf K, Ronniger M, Nussler AK
J Clin Med 8 (12): E2028
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2019,
Scarfì MR, Mattsson MO, Simkó M, Zeni O
Int J Environ Res Public Health 16 (22): E4548
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2019,
Jadia S, Qureshi S, Jain L, Shringirishi M
Indian J Otolaryngol Head Neck Surg 71 Suppl 2: 1169-1173
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2019,
Said-Salman IH, Jebaii FA, Yusef HH, Moustafa ME
J Biomed Phys Eng 9 (5): 579-586
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2019,
Ziegler P, Nussler AK, Wilbrand B, Falldorf K, Springer F, Fentz AK, Eschenburg G, Ziegler A, Stöckle U, Maurer E, Ateschrang A, Schröter S, Ehnert S
J Clin Med 8 (11): E2008
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2019,
Vuorinen AM, Pakarinen S, Jaakkola I, Holmström M, Kivistö S, Kaasalainen T
Acta Radiol 60 (11): 1414-1421
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2019,
Kozlov M, Angelone LM, Rajan S
IEEE Trans Electromagn Compat: 2311-2316
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2019,
Sekiba Y, Yamazaki K
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 83-86; ISBN 978-1-7281-1639-6
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2019,
Gomez-Tames J, Rashed E, Hirata A, Tarnaud T, Tanghe E, Van de Steene T, Martens L, Joseph W
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 162-165; ISBN 978-1-7281-1639-6
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[2019 Medical Technologies Congress (TIPTEKNO)], Izmir, Turkey. IEEE: pp. 1-4; ISBN 978-1-7281-2421-6
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2019,
Jamshed MA, Amjad O, Heliot F, Brown T
2019 IEEE Wireless Communications and Networking Conference Workshop (WCNCW), Marrakech, Morocco. IEEE: pp. 1-5; ISBN 978-1-7281-0923-7
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J Drugs Dermatol 18 (11): 1098-1102
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2019,
Azizi SMY, Hosseini Sarghein S, Majd A, Peyvandi M
Physiol Mol Biol Plants 25 (6): 1445-1456
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2019,
Nimpf S, Nordmann GC, Kagerbauer D, Malkemper EP, Landler L, Papadaki-Anastasopoulou A, Ushakova L, Wenninger-Weinzierl A, Novatchkova M, Vincent P, Lendl T, Colombini M, Mason MJ, Keays DA
Curr Biol 29 (23): 4052-4059.e4
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2019,
Bodemann R, Finke J, von Freeden J, Gritsch T, Heinrich H, Hoffmann M, Jeschke P, Joosten S, Krischek R, Reidenbach HD, Schiessl K, Schreiber M, Schühle E, Storch D, Stunder D
Fachverband für Strahlenschutz e. V. (FS),
FS-2019-180-AKNIR: 1-111
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2019,
Makarov S, Horner M, Noetscher G
Springer International Publishing, Cham (Schweiz); ISBN 978-3-030-21292-6
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2019,
Rahayu Y, Hilmi MF, Masdar H
2019 16th International Conference on Quality in Research (QIR): International Symposium on Electrical and Computer Engineering, Padang, Indonesia. IEEE: pp. 1-5; ISBN 978-1-7281-1899-4
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2019,
Feng X, Chen X, Wang Y, Wang J
2019 8th International Symposium on Next Generation Electronics (ISNE), Zhengzhou, China. IEEE: pp. 1-3; ISBN 978-1-7281-2063-8
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2019,
Sasaki K, Li K, Wake K, Watanabe S, Higashiyama J, Onishi T
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 43-46; ISBN 978-1-7281-1639-6
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2019,
Miwa K, Takenaka T, Hirata A
IEEE Trans Electromagn Compat 61 (6): 2024-2030
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2019,
Zachepa N, Chorna O, Rieznik D
2019 IEEE International Conference on Modern Electrical and Energy Systems (MEES), Kremenchuk, Ukraine. IEEE: pp. 158-161; ISBN 978-1-7281-2570-1
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2019,
Mondal SP, Padmini TN
2019 International Conference on Vision Towards Emerging Trends in Communication and Networking (ViTECoN), Vellore, India. IEEE: pp. 1-4; ISBN 978-1-5386-9354-4
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2019,
Rieznik D, Zachepa I, Zachepa N, Sukach S, Chenchevoi V, Vovna O
2019 IEEE International Conference on Modern Electrical and Energy Systems (MEES), Kremenchuk, Ukraine. IEEE: pp. 198-201; ISBN 978-1-7281-2570-1
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2019,
Gao G, Zhang R, Yang C, Meng H, Geng W, Hu B
IET Microwaves, Antennas & Propagation 13 (13): 2319 - 2323
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2019,
Lan Q, Zheng J, Chen J
2019 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, Atlanta, GA, USA. IEEE: pp. 1861-1862; ISBN 978-1-7281-0693-9
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2019,
Phaneuf M, Mojabi P
2019 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, Atlanta, GA, USA. IEEE: pp. 533-534; ISBN 978-1-7281-0693-9
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2019,
Shiina T, Yamazaki K
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 744-747; ISBN 978-1-7281-1639-6
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2019,
Kageyama I, Masuda H, Morimatsu Y, Ishitake T, Sakakibara K, Hikage T, Hirata A
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 766-769; ISBN 978-1-7281-1639-6