The following terms were included:
Magnetfeld, MF, "magnetic field", 磁界
-
2019,
Ji GJ, Wei JJ, Liu T, Li D, Zhu C, Yu F, Tian Y, Wang K, Zhang L, Hu P
Front Neurosci 13: 1155
-
2019,
Scarfì MR, Mattsson MO, Simkó M, Zeni O
Int J Environ Res Public Health 16 (22): E4548
-
2019,
Ziegler P, Nussler AK, Wilbrand B, Falldorf K, Springer F, Fentz AK, Eschenburg G, Ziegler A, Stöckle U, Maurer E, Ateschrang A, Schröter S, Ehnert S
J Clin Med 8 (11): E2008
-
2019,
Borrione L, Brunoni AR
Braz J Psychiatry 41 (5): 376-377
-
2019,
Hassanzahraee M, Zoghi M, Jaberzadeh S
Brain Connect 9 (10): 770-776
-
2019,
Sekiba Y, Yamazaki K
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 83-86; ISBN 978-1-7281-1639-6
-
2019,
Gomez-Tames J, Rashed E, Hirata A, Tarnaud T, Tanghe E, Van de Steene T, Martens L, Joseph W
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 162-165; ISBN 978-1-7281-1639-6
-
[2019 Medical Technologies Congress (TIPTEKNO)], Izmir, Turkey. IEEE: pp. 1-4; ISBN 978-1-7281-2421-6
-
2019,
Jamshed MA, Amjad O, Heliot F, Brown T
2019 IEEE Wireless Communications and Networking Conference Workshop (WCNCW), Marrakech, Morocco. IEEE: pp. 1-5; ISBN 978-1-7281-0923-7
-
2019,
D'Anci KE, Uhl S, Oristaglio J, Sullivan N, Tsou AY
Ann Intern Med 171 (12): 906-915
-
J Drugs Dermatol 18 (11): 1098-1102
-
2019,
Ho SY, Chen IC, Chen YJ, Lee CH, Fu CM, Liu FC, Liou HH
Stem Cells Int 2019: 8790176
-
2019,
Azizi SMY, Hosseini Sarghein S, Majd A, Peyvandi M
Physiol Mol Biol Plants 25 (6): 1445-1456
-
2019,
Nimpf S, Nordmann GC, Kagerbauer D, Malkemper EP, Landler L, Papadaki-Anastasopoulou A, Ushakova L, Wenninger-Weinzierl A, Novatchkova M, Vincent P, Lendl T, Colombini M, Mason MJ, Keays DA
Curr Biol 29 (23): 4052-4059.e4
-
2019,
Bodemann R, Finke J, von Freeden J, Gritsch T, Heinrich H, Hoffmann M, Jeschke P, Joosten S, Krischek R, Reidenbach HD, Schiessl K, Schreiber M, Schühle E, Storch D, Stunder D
Fachverband für Strahlenschutz e. V. (FS),
FS-2019-180-AKNIR: 1-111
-
2019,
Makarov S, Horner M, Noetscher G
Springer International Publishing, Cham (Schweiz); ISBN 978-3-030-21292-6
-
2019,
Rahayu Y, Hilmi MF, Masdar H
2019 16th International Conference on Quality in Research (QIR): International Symposium on Electrical and Computer Engineering, Padang, Indonesia. IEEE: pp. 1-5; ISBN 978-1-7281-1899-4
-
2019,
Feng X, Chen X, Wang Y, Wang J
2019 8th International Symposium on Next Generation Electronics (ISNE), Zhengzhou, China. IEEE: pp. 1-3; ISBN 978-1-7281-2063-8
-
2019,
Sasaki K, Li K, Wake K, Watanabe S, Higashiyama J, Onishi T
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 43-46; ISBN 978-1-7281-1639-6
-
2019,
Miwa K, Takenaka T, Hirata A
IEEE Trans Electromagn Compat 61 (6): 2024-2030
-
2019,
Zachepa N, Chorna O, Rieznik D
2019 IEEE International Conference on Modern Electrical and Energy Systems (MEES), Kremenchuk, Ukraine. IEEE: pp. 158-161; ISBN 978-1-7281-2570-1
-
2019,
Rieznik D, Zachepa I, Zachepa N, Sukach S, Chenchevoi V, Vovna O
2019 IEEE International Conference on Modern Electrical and Energy Systems (MEES), Kremenchuk, Ukraine. IEEE: pp. 198-201; ISBN 978-1-7281-2570-1
-
2019,
Phaneuf M, Mojabi P
2019 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, Atlanta, GA, USA. IEEE: pp. 533-534; ISBN 978-1-7281-0693-9
-
2019,
Shiina T, Yamazaki K
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 744-747; ISBN 978-1-7281-1639-6
-
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 166-169; ISBN 978-1-7281-1639-6