The following terms were included:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2018,
Aga K, Hirata A, Laakso I
2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands. IEEE: pp. 515-520; ISBN 978-1-4673-9699-8
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2018,
Karpowicz J, De Miguel-Bilbao S, Zradzńnski P, Gryz K, Falcone F, Ramos V
2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands. IEEE: pp. 972-975; ISBN 978-1-4673-9699-8
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2018,
Isrie S, Moonen N, Schipper H, Bergsma H, Lefcrink F
2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands. IEEE: pp. 500-505; ISBN 978-1-4673-9699-8
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2018,
Feliziani M, Campi T, Cruciani S, De Santis V
2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands. IEEE: pp. 155-160; ISBN 978-1-4673-9699-8
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2018,
Buesink F, Vout-Ardatjew R, Leferink L
2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands. IEEE: pp. 918-921; ISBN 978-1-4673-9699-8
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2018,
De Miguel-Bilbao S, Blas J, Falcone F, Ramos V
2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands. IEEE: pp. 510-514; ISBN 978-1-4673-9699-8
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2018,
Sadamitsu S, Leung SW, Lo WK, Sun WN
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: pp. 28-31; ISBN 978-1-5090-3955-5
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2018,
Sato K, Tsukahara T, Kamimura Y
2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands. IEEE: pp. 506-509; ISBN 978-1-4673-9699-8
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2018,
Kamimura Y, Inagaki S, Wake K
2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands. IEEE: pp. 855-859; ISBN 978-1-4673-9699-8
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2018,
Piper S, Ball L, Mandziuk M
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI), Long Beach, CA, USA. IEEE: pp. 448-453; ISBN 978-1-5386-6622-7