-
2020,
Dechent D, Emonds T, Stunder D, Schmiedchen K, Kraus T, Driessen S
Burns 46 (2): 267-278
-
2020,
Vale AL, Pereira AS, Morais A, de Carvalho P, Vilarinho R, Mendonça A, Noites A
J Cosmet Dermatol 19 (2): 359-367
-
2020,
Romeo S, Sannino A, Zeni O, Angrisani L, Massa R, Scarfi MR
IEEE J Electromagn RF Microw Med Biol 4 (1): 17-23
-
2020,
Attaran A, Handler WB, Chronik BA
IEEE J Electromagn RF Microw Med Biol 4 (1): 2 - 9
-
IEEE Trans Electromagn Compat 62 (2): 338-345
-
2020,
Boutet A, Hancu I, Saha U, Crawley A, Xu DS, Ranjan M, Hlasny E, Chen R, Foltz W, Sammartino F, Coblentz A, Kucharczyk W, Lozano AM
J Neurosurg 132 (2): 586–594
-
2020,
Boayue NM, Csifcsák G, Aslaksen P, Turi Z, Antal A, Groot J, Hawkins GE, Forstmann B, Opitz A, Thielscher A, Mittner M
Eur J Neurosci 51 (3): 755-780
-
2020,
Gerke M, de Ridder M, Mehnert C, Vogel E, Hoffmann M, Kurz T
State Office for the Environment of the Federal State of Baden-Württemberg (LUBW), Bavarian State Office for the Environment (LfU),
4. aktualisierte Auflage: 1-140
-
2019,
Chow JPW, Chung HSH, Chan LLH, Shen R, Tang SC
IEEE Transactions on Power Electronics 34 (10): 9779-9793
-
2019,
Seward WG, Huxtable RD, Beynon BP, Zvirblys A, Camacho-Hunt NJ, Albano M, Cipcigan LM
2019 54th International Universities Power Engineering Conference (UPEC), Bucharest, Romania. IEEE: pp. 1-6; ISBN 978-1-7281-3350-8
-
IEEE Trans Compon Packaging Manuf Technol 9 (7): 1253-1263
-
2019,
Yamanaka D, Takahashi M
2019 Wireless Days (WD), Manchester, UK. IEEE: pp. 1-4; ISBN 978-1-7281-0118-7
-
2019,
Bardati F, Di Carlofelice A, Tognolatti P
2019 PhotonIcs & Electromagnetics Research Symposium - Spring (PIERS-Spring), Rome, Italy. IEEE: pp. 2538-2546; ISBN 978-1-7281-3404-8
-
2019,
Becker G, Brandt R, Viertel T
Federal Office for Radiation Protection (BfS),
Ressortforschungsberichte zum Strahlenschutz, BfS-RESFOR-150/19: 1-52
-
Federal Office for Radiation Protection (BfS),
Ressortforschungsberichte zum Strahlenschutz, BfS-RESFOR-155/19: 1-122
-
2019,
Ortego-Isasa I, Martins A, Birbaumer N, Ramos-Murguialday A
2019 9th International IEEE/EMBS Conference on Neural Engineering (NER), San Francisco, CA, USA. IEEE: pp. 381-384; ISBN 978-1-5386-7922-7
-
2019,
Graybill P, Kiani M
IEEE Trans Biomed Circuits Syst 13 (1): 203-213
-
2019,
Wang C, Liang X, Freschi F
2019 IEEE Industry Applications Society Annual Meeting, Baltimore, MD, USA. IEEE: pp. 1-8; ISBN 978-1-5386-4540-6
-
2019 International Multi-Conference on Industrial Engineering and Modern Technologies (FarEastCon), Vladivostok, Russia. IEEE: pp. 1-4; ISBN 978-1-7281-0062-3
-
2019,
Wu I, Matsumoto Y, Gotoh K, Wake K, Watanabe S
2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Barcelona, Spain. IEEE: pp. 169-172; ISBN 978-1-7281-0595-6
-
2019,
Iqbal A, Basir A, Smida A, Mallat NK, Elfergani I, Rodriguez J, Kim S
IEEE Access 7: 111135-111144
-
2019,
Alshehri J, Alshalawi A, Khalid M
2019 8th International Conference on Renewable Energy Research and Applications (ICRERA), Brasov, Romania. IEEE, Rumänien: pp. 377-380; ISBN 978-1-7281-3588-5
-
2019,
Bird R, Naji S, Vowles B, Shaw A, Martin NA
Trauma 21 (4): 317-320
-
2019,
Kissi C, Särestöniemi M, Kumpuniemi T, Sonkki M, Myllymäki S, Srifi MN, Pomalaza-Raez C
IEEE Access 7: 149026-149038
-
Jaroszewski M, Thomas S, Rane AV (eds.): Advanced Materials for Electromagnetic Shielding: Fundamentals, Properties, and Applications. John Wiley & Sons, Inc.; pp. 109-146; ISBN 978-1-119-12861-8
