-
Federal Office for Radiation Protection (BfS),
Ressortforschungsberichte zur kerntechnischen Sicherheit und zum Strahlenschutz, BfS-RESFOR-154/19: 1-94
-
2019,
Burke MJ, Kaptchuk TJ, Pascual-Leone A
Ann Neurol 85 (1): 12-20
-
2019,
Xu J, Liu K, Chen T, Zhan T, Ouyang Z, Wang Y, Liu W, Zhang X, Sun Y, Xu G, Wang X
Aging 11 (22): 10385-10408
-
2019,
Ehnert S, Schröter S, Aspera-Werz RH, Eisler W, Falldorf K, Ronniger M, Nussler AK
J Clin Med 8 (12): E2028
-
2019,
Nielsen C, Solov'yov IA
J Chem Phys 151 (19): 194105
-
2019,
Zebhauser PT, Vernet M, Unterburger E, Brem AK
Neuropsychol Rev 29 (4): 397-420
-
2019,
Ji GJ, Wei JJ, Liu T, Li D, Zhu C, Yu F, Tian Y, Wang K, Zhang L, Hu P
Front Neurosci 13: 1155
-
2019,
Scarfì MR, Mattsson MO, Simkó M, Zeni O
Int J Environ Res Public Health 16 (22): E4548
-
2019,
Ziegler P, Nussler AK, Wilbrand B, Falldorf K, Springer F, Fentz AK, Eschenburg G, Ziegler A, Stöckle U, Maurer E, Ateschrang A, Schröter S, Ehnert S
J Clin Med 8 (11): E2008
-
2019,
Borrione L, Brunoni AR
Braz J Psychiatry 41 (5): 376-377
-
2019,
Hassanzahraee M, Zoghi M, Jaberzadeh S
Brain Connect 9 (10): 770-776
-
2019,
Kozlov M, Angelone LM, Rajan S
IEEE Trans Electromagn Compat: 2311-2316
-
2019,
Sekiba Y, Yamazaki K
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 83-86; ISBN 978-1-7281-1639-6
-
2019,
Gomez-Tames J, Rashed E, Hirata A, Tarnaud T, Tanghe E, Van de Steene T, Martens L, Joseph W
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 162-165; ISBN 978-1-7281-1639-6
-
2019,
Yu X, Ren J, Wang J, Du J, Ma J, Ren Y
BIBE 2019; The Third International Conference on Biological Information and Biomedical Engineering, Hangzhou, China. VDE: 1-5; ISBN 978-3-8007-5026-9
-
2019,
Zhang J, Yan S, Hu X, Vandenbosch GAE
IEEE Trans Biomed Circuits Syst 13 (6): 1583-1592
-
2019,
D'Anci KE, Uhl S, Oristaglio J, Sullivan N, Tsou AY
Ann Intern Med 171 (12): 906-915
-
J Drugs Dermatol 18 (11): 1098-1102
-
Biomicrofluidics 13 (6): 064107
-
2019,
Azizi SMY, Hosseini Sarghein S, Majd A, Peyvandi M
Physiol Mol Biol Plants 25 (6): 1445-1456
-
2019,
Bodemann R, Finke J, von Freeden J, Gritsch T, Heinrich H, Hoffmann M, Jeschke P, Joosten S, Krischek R, Reidenbach HD, Schiessl K, Schreiber M, Schühle E, Storch D, Stunder D
Fachverband für Strahlenschutz e. V. (FS),
FS-2019-180-AKNIR: 1-111
-
2019,
Makarov S, Horner M, Noetscher G
Springer International Publishing, Cham (Schweiz); ISBN 978-3-030-21292-6
-
2019,
Feng X, Chen X, Wang Y, Wang J
2019 8th International Symposium on Next Generation Electronics (ISNE), Zhengzhou, China. IEEE: 1-3; ISBN 978-1-7281-2063-8
-
2019,
Miwa K, Takenaka T, Hirata A
IEEE Trans Electromagn Compat 61 (6): 2024-2030
-
2019,
Zachepa N, Chorna O, Rieznik D
2019 IEEE International Conference on Modern Electrical and Energy Systems (MEES), Kremenchuk, Ukraine. IEEE: 158-161; ISBN 978-1-7281-2570-1