The following terms were included:
電磁気の, elektromagnetisch, electromagnetic
-
2024,
Teranishi M, Ito M, Huang Z, Nishiyama Y, Masuda A, Mino H, Tachibana M, Inada T, Ohno K
Int J Mol Sci 25 (20): 11315
-
2024,
Gerdesmeyer L, Tübel J, Obermeier A, Harrasser N, Glowalla C, von Eisenhart-Rothe R, Burgkart R
Biomedicines 12 (10): 2269
-
2024,
Wang X, Zhou G, Lin J, Zhang Z, Qin T, Guo L, Wang H, Huang Z, Ding G
Biology 13 (10): 806
-
2024,
Mildaziene V, Zukiene R, Fomins LD, Nauciene Z, Minkute R, Jarukas L, Drapak I, Georgiyants V, Novickij V, Koga K, Shiratani M, Mykhailenko O
Int J Mol Sci 25 (19): 10412
-
2024,
Ryu Y, Wague A, Liu X, Feeley BT, Ferguson AR, Morioka K
Front Mol Neurosci 17: 1427070
-
2024,
Guzman-Armenteros TM, Ruales J, Ramos-Guerrero L
Foods 13 (19): 3058
-
2024,
Kutscha N, Mahmutovic M, Bhusal B, Vu J, Chemlali C, Hansen SJD, May MW, Knake S, Golestanirad L, Keil B
Magn Reson Med [in press]
-
2024,
Shukla G, Awasthi V, Goswami P, Singh S
2024 IEEE 4th International Conference on Sustainable Energy and Future Electric Transportation (SEFET), Hyderabad, India. IEEE: pp. 01-07; ISBN 9798350384000
-
2024,
Devi PS, Rekha M, Vemula SN, Pohanekar O, Bhupathi HP, Al-Fatlawy RR, Haranatti JS
2024 IEEE 4th International Conference on Sustainable Energy and Future Electric Transportation (SEFET), Hyderabad, India. IEEE: pp. 1-6; ISBN 9798350384000
-
2024,
Kiouvrekis Y, Zikas S, Katis I, Tsilikas I, Filippopoulos I
Sci Total Environ 955: 176907
-
2024,
Psenakova Z, Gombarska D, Lauko L
2024 25th International Conference on Computational Problems of Electrical Engineering (CPEE), Stronie Śląskie, Poland. IEEE: pp. 1-4; ISBN 9798331506650
-
2024,
Poljak D, Carev I, Sesnic ZN
2024 International Conference on Software, Telecommunications and Computer Networks (SoftCOM), Split, Croatia. IEEE: pp. 1-6; ISBN 9798350354614
-
2024,
Benova M, Bacova F, Psenakova Z
2024 25th International Conference on Computational Problems of Electrical Engineering (CPEE), Stronie Śląskie, Poland. IEEE: pp. 1-4; ISBN 9798331506650
-
2024,
Manoharan S, Mahalakshmi B, Ananthi K, Sindhu MP
2024 8th International Conference on I-SMAC (IoT in Social, Mobile, Analytics and Cloud) (I-SMAC), Kirtipur, Nepal. IEEE: pp. 301-307; ISBN 9798350376432
-
2024,
Li Y, Mo C, Li J, Yang P, Wang J, Yu H, Hu S, Zhang P, Liu X
IEEE Trans Instrum Meas 73: 1-9
-
2024,
Cvetkovic M, Dodig H, Poljak D
J Commun Softw Syst 20 (1): 125-136
-
2024,
Cai W, Xiao Y, Yan J, Peng H, Tu C
Front Cell Dev Biol 12: 1489774
-
2024,
Vu MO, Butters BM, Canal CE, Figueroa XA
Electromagn Biol Med 43 (4): 328-336
-
2024,
Blanco-Penedo I, Palacios-Riocerezo C, Mena Y, Alvarez-Rodriguez J
ITEA-Inf Tec Econ Agrar [in press]
-
2024,
Yavas MC, Kilitci A, Celik E, Yegin K, Sirav B, Varol S
Int J Radiat Res 22 (3): 529-536
-
2024,
Karaman IP, Coskun O, Senol N, Sahin M, Comlekci S
Int J Radiat Res 22 (3): 537-543
-
2024,
Alemaryeen A, Noghanian S
IEEE Open Journal of Antennas and Propagation 5 (6): 1539-1550
-
2024,
Kang JK, Etchill E, Verdi K, Velez AK, Kearney S, Dodd-O J, Bush E, By S, Boskamp E, Wilcox C, Choi CW, Kim BS, Whitman GJR, Cho SM
Crit Care Explor 6 (10): e1169
-
2024,
Khorseva NI, Grigoriev PE
Health Risk Analysis no. 3: 146–154
-
2024,
Jin K, Zhao D, Zhou J, Zhang X, Wang Y, Wu Z
Apoptosis 29 (11-12): 2108-2127
-
2024,
Foroughimehr N, Vilagosh Z, Yavari A, Wood A
Bioelectromagnetics 45 (8): 375-386
-
2024,
Sylvester E, Deng C, McIntosh R, Iskra S, Frankland J, McKenzie R, Croft RJ
Bioelectromagnetics 45 (8): 387-398
-
2024,
Jamal L, Michelant L, Delanaud S, Hugueville L, Mazet P, Lévêque P, Baz T, Bach V, Selmaoui B
Exp Physiol 109 (12): 2122-2133
-
2024,
Kim HY, Son Y, Jeong YJ, Lee SH, Kim N, Ahn YH, Jeon SB, Choi HD, Lee HJ
Int J Mol Sci 25 (20): 10875
-
2024,
González AM, Morcillo AD, Martínez ML, Temnani A, Reyes PB, García SZ
IEEE Access 12: 152087-152096
-
2024,
Murphy DLK, Koponen LM, Wood E, Li Y, Bukhari-Parlakturk N, Goetz SM, Peterchev AV
Brain Stimul 17 (6): 1197-1207
-
2024,
Picelli A, DI Censo R, Tomasello S, Scaturro D, Letizia Mauro G, Smania N, Filippetti M, Physical Modalities Section of the Italian Society of Physical and Rehabilitation Medicine
Eur J Phys Rehabil Med 60 (6): 989-994
-
2024,
Alharbi N, Alassiri M
Int J Cell Biol 2024: 7093771
-
2024,
Moon J, Kwon J, Mun Y
Environ Health 23: 82
-
2024 IEEE 29th International Seminar/Workshop on Direct and Inverse Problems of Electromagnetic and Acoustic Wave Theory (DIPED), Tbilisi, Georgia. IEEE: pp. 186-189; ISBN 9798331506094
-
2024,
Nozadze T, Kharshiladze D, Jeladze V, Ghvedashvili G, Zaridze R
2024 IEEE 29th International Seminar/Workshop on Direct and Inverse Problems of Electromagnetic and Acoustic Wave Theory (DIPED), Tbilisi, Georgia. IEEE: pp. 175-179; ISBN 9798331506094
-
2024,
Yao M, Wei Z, Li K, Pedersen GF, Zhang S
IEEE Trans Antennas Propag [in press]
-
2024,
Nozadze T, Haueisen J, Jeladze V
2024 IEEE 29th International Seminar/Workshop on Direct and Inverse Problems of Electromagnetic and Acoustic Wave Theory (DIPED), Tbilisi, Georgia. IEEE: pp. 180-185; ISBN 9798331506094
-
2024,
Lu ZJ, Gu HY, Li ZQ, Lin FX
Exp Ther Med 28 (6): 446
-
2024,
Abtin S, Seyedaghamiri F, Aalidaeijavadi Z, Farrokhi AM, Moshrefi F, Ziveh T, Zibaii MI, Aliakbarian H, Rezaei-Tavirani M, Haghparast A
Brain Res Bull 217: 111090
-
2024,
Zuo Z, Wang Q, Zheng J, Jeong H, Kumar A, Chen J
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: pp. 369-373; ISBN 9798350360400
-
2024,
Huang X, Scoles S, Nguyen P, Chen J, Wisniewski J, Wan Y, Jiang GJ
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: pp. 365-368; ISBN 9798350360400
-
2024,
Lee C, Rhee J, Lee S, Kwon H, Park Y, Shin Y, Ahn S
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: pp. 604-607; ISBN 9798350360400
-
2024,
Ardeshirpour Y, Guag J, Silberberg JL, Seidman SJ
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: pp. 359-364; ISBN 9798350360400
-
2024,
Cvetković M, Poljak D, Dodig H
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: pp. 167-172; ISBN 9798350360400
-
2024,
Campi T, Cruciani S, Maradei F, Feliziani M
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: pp. 446-449; ISBN 9798350360400
-
2024,
Clemente GC, Morais GI, Fonseca FHS, Concentino GL, Fraidenraich G
IEEE Electromagn Compat Mag 13 (2): 40-53
-
2024,
Jacksha RD, Sunderman CB, Zhou C
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: pp. 205-210; ISBN 9798350360400
-
2024,
Ribeiro A, Mendes C, Pinho P
2024 International Conference on Electromagnetics in Advanced Applications (ICEAA), Lisbon, Portugal. IEEE: pp. 458-463; ISBN 9798350360981
-
2024,
Moghnieh H, Rammal M, Barakeh R, Rachid E
IEEE Access 12: 151834-151845