The Effect of Lead Winding Near IPG on AIMD Models under MR RF Exposure
temp.
By:
Zuo Z, Wang Q, Zheng J, Jeong H, Kumar A, Chen J
Published in: 2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE, 2024: pp. 369-373; ISBN 9798350360400
