The following terms were included:
電磁両立性, "elektromagnetische Verträglichkeit", EMC, EMV, "electromagnetic compatibility"
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2022,
Kapetanović AL, Poljak D
IEEE Trans Electromagn Compat 64 (5): 1296-1303
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Energies 15 (12): 4455
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2022,
Bertoluzzo M, Di Barba P, Forzan M, Mognaschi ME, Sieni E
Eng Comput 39 (7): 2802-2819
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2022,
Yang B, Chen CH, Graham SJ
IEEE Letters on Electromagnetic Compatibility Practice and Applications 4 (3): 83-87
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2022,
Liu S, Onishi T, Taki M, Watanabe S
IEEE Trans Electromagn Compat 64 (4): 963-974
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2022,
Gifuni A, Adil M, Grassini G, Buono A, Nunziata F, Micheli D, Migliaccio M
IEEE Trans Electromagn Compat 64 (4): 951-962
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IEEE Trans Electromagn Compat 64 (4): 941-950
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2022,
Xiao C, Hao S, Cheng D, Liao C
IEEE Trans Biomed Circuits Syst 16 (3): 372-383
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2022,
Gryz K, Karpowicz J, Zradziński P
Sensors 22 (5): 1719
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2022,
Shah IA, Basir A, Cho Y, Yoo H
IEEE Trans Electromagn Compat 64 (3): 640-649
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2022,
Budnarowska M, Mizeraczyk J, Bisewski D
Prz Elektrotechniczny 98 (2): 110-113
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2022,
Liu J, Wang Y, Guo R, Wang Q, Zheng J, Kurpad K, Kainz W, Chen J
IEEE Trans Electromagn Compat 64 (2): 286-294
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2022,
Lan J, Diao Y, Duan X, Hirata A
IEEE Trans Electromagn Compat 64 (2): 551-558
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2022,
Sassi O, Kadi M, Niederholz M
IEEE Trans Electromagn Compat 64 (1): 139-149
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2022,
Narusue Y, Morikawa H
IEEE Trans Magn 58 (2): 1-5
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Institute of Electrical and Electronics Engineers (IEEE),
IEEE Std 149-2021: 1-207, ISBN 978-1-5044-8017-8
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2021,
EMF-Institut (Fachinstitut für Elektromagnetische Verträglichkeit zur Umwelt), Nießen P
1-28
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2021 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Nusa Dua - Bali, Indonesia. IEEE: pp. 1-4; ISBN 978-1-7281-7622-2
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IEEE Trans Electromagn Compat 63 (1): 286-293
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2021,
Kwon D, Lee YS, Lee AK, Choi HD
IEEE Trans Electromagn Compat 63 (2): 384-389
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2021,
Ruddle AR, Martin AJM, Emery M
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: pp. 1-6; ISBN 978-1-6654-4889-5
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2021,
Chan G, Lee CC, Wei Y, Tsang KF
2021 IEEE International Symposium on Product Compliance Engineering - Asia (ISPCE-ASIA), Taipei, Taiwan. IEEE: pp. 01-06; ISBN 978-1-6654-4343-2
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2021,
Yang C, Schierholz M, Trunczik E, Helmich LM, Brüns HD, Schuster C
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: pp. 697-702; ISBN 978-1-6654-4889-5
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German Commission for Electrical, Electronic & Information Technologies of DIN and VDE (DKE),
DIN EN IEC 61980-1:2021-09 VDE 0122-10-1:2021-09
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2021,
Das M, Vogt-Ardatjew R, Van den Berg B, Leferink F
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: pp. 857-861; ISBN 978-1-6654-4889-5
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2021,
Song X, Li R, Yue Y, Wan S
2021 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Nusa Dua - Bali, Indonesia. IEEE: pp. 1-4; ISBN 978-1-7281-7622-2
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2021,
Adegbola R, Fifatin FX, Agbokpanzo R, Acakpovi A
2021 IEEE 8th International Conference on Adaptive Science and Technology (ICAST), Accra, Ghana. IEEE: pp. 1-6; ISBN 978-1-6654-2718-0
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2021,
Evangelista J, Loschi H, Costa ET, Smolenski R, Moonen N, Vogt-Ardatjew R
2021 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Nusa Dua - Bali, Indonesia. IEEE: pp. 1-4; ISBN 978-1-7281-7622-2
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2021,
Ardiatna W, Nugroho HW, Hidayat SW, Sukma I, Supono I, Mandaris D
2021 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Nusa Dua - Bali, Indonesia. IEEE: pp. 1-4; ISBN 978-1-7281-7622-2
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2021,
Diao Y, Li K, Sasaki K, Kodera S, Laakso I, El Hajj W, Hirata A
IEEE Trans Electromagn Compat 63 (5): 1709-1716
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2021,
De Miguel-Bilbao S, Hernandez JA, Suarez OJ, Marina P, Febles VM, Rabassa LE, Suarez S, Karpowicz J, Zradzinski P, Gryz K, Aguirre E, Ramos V
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: pp. 13-18; ISBN 978-1-6654-4889-5
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2021,
Cruciani S, Campi T, Maradei F, Feliziani M
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: pp. 381-385; ISBN 978-1-6654-4889-5
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2021,
Svistunou A, Mordachev V, Sinkevich E, Ye M, Dubovik A
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: pp. 214-219; ISBN 978-1-6654-4889-5
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2021,
Sârbu A, Miclăuș S, Șorecău E, Bechet P
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: pp. 243-248; ISBN 978-1-6654-4889-5
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2021,
Yang X, Zheng J, Chen J
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: pp. 703-706; ISBN 978-1-6654-4889-5
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2021,
Andersen E, Casados C, Truong BD, Roundy S
IEEE Trans Electromagn Compat 63 (5): 1735-1747
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2021,
Hirata A, Diao Y, Onishi T, Sasaki K, Ahn S, Colombi D, De Santis V, Laakso I, Giaccone L, Joseph W, Rashed EA, Kainz W, Chen J
IEEE Trans Electromagn Compat 63 (5): 1619-1630
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2021,
Seidman SJ, Guag J, Beard B, Arp Z
Heart Rhythm 18 (10): 1741-1744
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2021,
Vu J, Nguyen BT, Bhusal B, Baraboo J, Rosenow J, Bagci U, Bright MG, Golestanirad L
IEEE Trans Electromagn Compat 63 (5): 1757-1766
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2021,
Sasaki K, Kawabata K, Shimizu Y, Watanabe S, Wake K, Suga R, Hashimoto O
IEEE Trans Electromagn Compat 63 (5): 1631-1639
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2021,
Campi T, Cruciani S, Maradei F, Montalto A, Musumeci F, Feliziani M
IEEE Trans Electromagn Compat 63 (5): 1717-1725
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2021,
Šušnjara A, Dodig H, Poljak D, Cvetković M
IEEE Trans Electromagn Compat 63 (5): 1667-1679
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2021,
Miwa K, Suzuki Y, Lan J, Diao Y, Hirata A
IEEE Trans Electromagn Compat 63 (5): 1640-1648
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2021,
Omi S, Sasaki K, Wake K
IEEE Trans Electromagn Compat 63 (5): 1649-1657
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2021,
Jeong H, Ntolkeras G, Grant PE, Bonmassar G
IEEE Trans Electromagn Compat 63 (5): 1748-1756
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2021 17th Conference on Electrical Machines, Drives and Power Systems (ELMA), Sofia, Bulgaria. IEEE: pp. 1-4; ISBN 978-1-6654-1186-8
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2021,
Andreica S, Munteanu C, Gliga M, Pacurar C, Giurgiuman A, Constantinescu C, Morari C
2021 9th International Conference on Modern Power Systems (MPS), Cluj-Napoca, Romania. IEEE: pp. 1-4; ISBN 978-1-6654-3383-9
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2021,
Yang W, Chen Q, Xu H, Li Y, Liang W, Dawalibi FP
2021 4th International Conference on Energy, Electrical and Power Engineering (CEEPE), Chongqing, China. IEEE: pp. 599-604; ISBN 978-1-6654-3364-8
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2021,
Seidman SJ, Bassen HI
Biomed Instrum Technol 55 (3): 91-95
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2021,
Xu B, Colombi D, Törnevik C, Ghasemifard F, Chen J
IEEE Trans Electromagn Compat 63 (5): 1680-1689