The following terms were included:
電磁両立性, "elektromagnetische Verträglichkeit", EMC, EMV, "electromagnetic compatibility"
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2021,
Das M, Vogt-Ardatjew R, Van den Berg B, Leferink F
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: 857-861; ISBN 978-1-6654-4889-5
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2021,
Song X, Li R, Yue Y, Wan S
2021 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Nusa Dua - Bali, Indonesia. IEEE: 1-4; ISBN 978-1-7281-7622-2
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2021,
Adegbola R, Fifatin FX, Agbokpanzo R, Acakpovi A
2021 IEEE 8th International Conference on Adaptive Science and Technology (ICAST), Accra, Ghana. IEEE: 1-6; ISBN 978-1-6654-2718-0
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2021,
Evangelista J, Loschi H, Costa ET, Smolenski R, Moonen N, Vogt-Ardatjew R
2021 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Nusa Dua - Bali, Indonesia. IEEE: 1-4; ISBN 978-1-7281-7622-2
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2021,
Ardiatna W, Nugroho HW, Hidayat SW, Sukma I, Supono I, Mandaris D
2021 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Nusa Dua - Bali, Indonesia. IEEE: 1-4; ISBN 978-1-7281-7622-2
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2021,
Diao Y, Li K, Sasaki K, Kodera S, Laakso I, El Hajj W, Hirata A
IEEE Trans Electromagn Compat 63 (5): 1709-1716
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2021,
De Miguel-Bilbao S, Hernandez JA, Suarez OJ, Marina P, Febles VM, Rabassa LE, Suarez S, Karpowicz J, Zradzinski P, Gryz K, Aguirre E, Ramos V
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: 13-18; ISBN 978-1-6654-4889-5
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2021,
Cruciani S, Campi T, Maradei F, Feliziani M
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: 381-385; ISBN 978-1-6654-4889-5
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2021,
Svistunou A, Mordachev V, Sinkevich E, Ye M, Dubovik A
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: 214-219; ISBN 978-1-6654-4889-5
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2021,
Sârbu A, Miclăuș S, Șorecău E, Bechet P
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: 243-248; ISBN 978-1-6654-4889-5