The following terms were included:
電磁両立性, "elektromagnetische Verträglichkeit", EMC, EMV, "electromagnetic compatibility"
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2020,
Yang X, Zheng J, Chen J
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: pp. 266-269; ISBN 978-1-7281-7431-0
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2020,
Rumeng T, Ying S, Tong W, Wentao Z
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: pp. 659-662; ISBN 978-1-7281-7431-0
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2020,
Richter A, Ferková Z, Morava J
2020 ELEKTRO, Taormina, Italy. IEEE: pp. 1-6; ISBN 978-1-7281-7543-0
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2020,
Gao Z, Zhang W, Chen X
Zhongguo Yi Liao Qi Xie Za Zhi 44 (4): 302-306
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2020,
Azaro R, Gandolfo A
IEEE Trans Electromagn Compat 62 (4): 1611-1618
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2020,
Titov EV, Soshnikov AA, Drobyazko ON
2020 International Conference on Industrial Engineering, Applications and Manufacturing (ICIEAM), Sochi, Russia. IEEE: pp. 1-5; ISBN 978-1-7281-4591-4
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IEEE Electromagn Compat Mag 9 (2): 27-29
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IEEE Trans Electromagn Compat 62 (4): 1443-1450
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2020,
Brizi D, Fontana N, Tucci M, Barmada S, Monorchio A
IEEE Trans Electromagn Compat 62 (4): 1312-1322
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2020,
Rashed EA, Diao Y, Tanaka S, Sakai T, Gomez-Tames J, Hirata A
IEEE Trans Electromagn Compat 62 (6): 2704-2713
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2020,
Gusarov AV, Rostovtsev VL, Safonov LV, Shurygin SN
Zh Nevrol Psikhiatr Im S S Korsakova 120 (2): 76-80
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2020,
Arduino A, Bottauscio O, Chiampi M, Giaccone L, Liorni I, Kuster N, Zilberti L, Zucca M
IEEE Trans Electromagn Compat 62 (5): 1939-1950
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2020,
Wu J, Qi Y, Gong G, Fan J, Miao M, Yu W, Ma J, Drewniak JL
IEEE Trans Electromagn Compat 62 (6): 2604-2612
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2020,
Liorni I, Lisewski T, Capstick MH, Kuehn S, Neufeld E, Kuster N
IEEE Trans Electromagn Compat 62 (4): 1323-1332
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2020,
Zheng J, Lan Q, Zhang X, Kainz W, Chen J
IEEE Trans Electromagn Compat 62 (3): 673-681
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2020,
Attaran A, Handler WB, Chronik BA
IEEE J Electromagn RF Microw Med Biol 4 (1): 2 - 9
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2020,
Attaran A, Handler WB, Chronik BA
IEEE Trans Electromagn Compat 62 (1): 186 - 193
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IEEE Trans Electromagn Compat 62 (2): 338-345
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2019,
Wu I, Matsumoto Y, Gotoh K, Wake K, Watanabe S
2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Barcelona, Spain. IEEE: pp. 169-172; ISBN 978-1-7281-0595-6
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2019,
Ruddle AR, Martin AJM
IEEE Electromagn Compat Mag 8 (3): 75-85
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2019,
Le DT, Li K, Watanabe S, Onishi T
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 78-81; ISBN 978-1-7281-1639-6
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2019,
Hussien HI, Ayob MA, Warsito IF, Supriyanto E, Reihannisha I
2019 International Conference on Technologies and Policies in Electric Power & Energy, Yogyakarta, Indonesia. IEEE: pp. 1-4; ISBN 978-1-7281-5693-4
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2019,
Bieth F, Delmote P, Schneider M
IEEE Trans Plasma Sci 47 (6): 2987-2994
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2019,
Liu J, Zheng J, Zeng Q, Wang Q, Rondoni J, Olsen J, Kainz W, Chen J
IEEE Trans Electromagn Compat 61 (4): 1091-1097
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2019,
Virjoghe EO, Bancuta I, Husu AG, Cazacu D, Florescu V
J Sci Arts No.1 (46): 249-259