The following terms were included:
磁界強度, "magnetische Feldstärke", H-Feld, "magnetic field strength", "H field"
-
2019,
Sarbu A, Bechet A, Balan T, Robu D, Bechet P, Miclaus S
Measurement 134: 874-887
-
2019,
Rahayu Y, Rosdiansyah R, Amri R, Ngah R
2019 8th Asia-Pacific Conference on Antennas and Propagation (APCAP), Incheon, Korea. IEEE: 75-76; ISBN 978-1-6654-0055-8
-
2019 19th International Symposium on Electromagnetic Fields in Mechatronics, Electrical and Electronic Engineering (ISEF), Nancy, France. IEEE: 1-2; ISBN 978-1-7281-1561-0
-
2019,
Andersen E, Truong BD, Roundy S
2019 IEEE Wireless Power Transfer Conference (WPTC), London, UK. IEEE: 106-110; ISBN 978-1-7281-0706-6
-
2019,
Rokunuzzaman M, Ahmed A, Baum T, Rowe WST
2019 IEEE International Conference on Consumer Electronics - Asia (ICCE-Asia), Bangkok, Thailand. IEEE: 36-38; ISBN 978-1-7281-3337-9
-
2019,
Michalowska J, Jozwik J, Tofil A
2019 IEEE 5th International Workshop on Metrology for AeroSpace (MetroAeroSpace), Torino, Italy. IEEE: 366-370; ISBN 978-1-7281-1345-6
-
2019,
Gomez-Tames J, Rashed E, Hirata A, Tarnaud T, Tanghe E, Van de Steene T, Martens L, Joseph W
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 162-165; ISBN 978-1-7281-1639-6
-
2019,
Rahayu Y, Hilmi MF, Masdar H
2019 16th International Conference on Quality in Research (QIR): International Symposium on Electrical and Computer Engineering, Padang, Indonesia. IEEE: 1-5; ISBN 978-1-7281-1899-4
-
2019,
Miwa K, Takenaka T, Hirata A
IEEE Trans Electromagn Compat 61 (6): 2024-2030
-
2019,
Feng Z, Diao Y, Sun W, He Y, Leung PSW
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 48-51; ISBN 978-1-7281-1639-6