2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: pp. 270-275; ISBN 978-1-7281-7431-0
2020,
Zhang Y, Wang J, Liu X, Ding L, Wu X, He M, Hou H, Ruan G, Lai J, Chen C
2020,
Cabré-Riera A, Marroun HE, Muetzel R, van Wel L, Liorni I, Thielens A, Birks LE, Pierotti L, Huss A, Joseph W, Wiart J, Capstick M, Hillegers M, Vermeulen R, Cardis E, Vrijheid M, White T, Röösli M, Tiemeier H, Guxens M