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2024,
Huang X, Scoles S, Nguyen P, Chen J, Wisniewski J, Wan Y, Jiang GJ
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: pp. 365-368; ISBN 9798350360400
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Ardeshirpour Y, Guag J, Silberberg JL, Seidman SJ
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