2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 334-337; ISBN 978-1-7281-1639-6
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Tognola G, Chiaramello E, Bonato M, Magne I, Souques M, Fiocchi S, Parazzini M, Ravazzani P