The following terms were included:
中間周波, Zwischenfrequenz, "intermediate frequency"
-
2024,
Cai Z, Yang Z, Wang Y, Li Y, Zhao H, Zhao H, Yang X, Wang C, Meng T, Tong X, Zheng H, He Z, Niu C, Yang J, Chen F, Yang Z, Zou Z, Li W
Front Neurol 15: 1413236
-
2024,
Zhang S, Chen L, Woon E, Liu J, Ryu J, Chen H, Fang H, Feng B
bioRxiv: the Preprint Server for Biology (bioRxiv) (ed.),
2024.10.13.618090
-
2024,
Markovska IV, Sokolova II, Garmash OV, Savieliieva NN, Tomilina TV, Shapkyn AS
World Med Biol 87 (1): 129-134
-
2024,
Ignatov I, Huether F, Popova TP, Ignatov AI, Iliev MT, Stoyanov C
Plant Sci Today 11 (2): 553-561
-
2024,
Swiss Tropical and Public Health Institute (Swiss TPH), Fields at Work GmbH, Grolimund + Partner AG, NED-TECH AG
Federal Office for the Environment (FOEN),
1-137
-
2024,
Luu BL, Trinh T, Finn HT, Aplin FP, Gandevia SC, Héroux ME, Butler JE
J Physiol 602 (22): 6281-6299
-
2024,
Cruciani S, Campi T, Maradei F, Feliziani M
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, Brugge, Belgium. IEEE: pp. 816-820; ISBN 9798350343045
-
2024,
Miwa K, Ota S, Kawai K
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, Brugge, Belgium. IEEE: pp. 92-97; ISBN 9798350343045
-
2024,
Ankarson P, Bergqvist B
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, Brugge, Belgium. IEEE: pp. 590-594; ISBN 9798350343045
-
2024,
Stroka S, Haussmann N, Kasolis F, Clemens M
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, Brugge, Belgium. IEEE: pp. 762-767; ISBN 9798350343045
-
2024,
Xiang N, Huang Z, Zhang C, Huang J, Wang Z, Zhang J, Wu C, Peng W, Zhang J
Int J Pharm X 8: 100289
-
2024,
Mildaziene V, Zukiene R, Fomins LD, Nauciene Z, Minkute R, Jarukas L, Drapak I, Georgiyants V, Novickij V, Koga K, Shiratani M, Mykhailenko O
Int J Mol Sci 25 (19): 10412
-
2024,
Devi PS, Rekha M, Vemula SN, Pohanekar O, Bhupathi HP, Al-Fatlawy RR, Haranatti JS
2024 IEEE 4th International Conference on Sustainable Energy and Future Electric Transportation (SEFET), Hyderabad, India. IEEE: pp. 1-6; ISBN 9798350384000
-
2024,
Poljak D, Carev I, Sesnic ZN
2024 International Conference on Software, Telecommunications and Computer Networks (SoftCOM), Split, Croatia. IEEE: pp. 1-6; ISBN 9798350354614
-
2024,
Jeebklum P, Sumpavakup C
IEEE Access 12: 156717-156729
-
2024,
Guo Y, Wang W, Li W, Li J, Zhu M, Song R, Zhu W, Wang L, Ji Z, Shi X
Int J Hyperthermia 41 (1): 2396122
-
2024,
Tota M, Jonderko L, Witek J, Novickij V, Kulbacka J
Int J Mol Sci 25 (16): 8973
-
2024,
Heo J, Jo Y, Yoon M
Clin Transl Oncol [in press]
-
2024,
Modesto KAG, Raposo PKS, da Silva Almeida I, Vaz MA, Durigan JLQ
Physiol Rep 12 (20): e70039
-
2024,
Toledano-Macias E, Martinez-Pascual MA, Cecilia-Matilla A, Bermejo-Martinez M, Perez-Gonzalez A, Jara RC, Sacristan S, Hernandez-Bule ML
Int J Mol Sci 25 (19): 10663
-
2024,
Fang K, Cheng W, Yu B
J Mol Neurosci 74 (4): 98
-
2024,
Karimi N, Amirfattahi R, Zeidaabadi Nezhad A
Front Hum Neurosci 18: 1436205
-
2024,
Lu ZJ, Gu HY, Li ZQ, Lin FX
Exp Ther Med 28 (6): 446
-
2024,
Ardeshirpour Y, Guag J, Silberberg JL, Seidman SJ
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: pp. 359-364; ISBN 9798350360400
-
2024,
Campi T, Cruciani S, Maradei F, Feliziani M
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: pp. 446-449; ISBN 9798350360400