The following terms were included:
"kabellose Leistungsübertragung", "drahtlose Energieübertragung", "induktives Laden", WPT, "wireless power transfer", "inductive charging", "wireless charging", "wireless power"
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2019,
Ishii N, Shimizu Y, Chakarothai J, Wake K, Watanabe S
2019 International Symposium on Antennas and Propagation (ISAP), Xi'an, China. IEEE: pp. 1-3; ISBN 978-1-7281-5113-7
-
2019,
Songcen W, Bin W, Xiaokang W, Chong X, Jinxing X, Weimei G, Jiaqi X
2019 22nd International Conference on Electrical Machines and Systems (ICEMS), Harbin, China. IEEE: pp. 1-7; ISBN 978-1-7281-3399-7
-
2019,
Zhang J, Liu Y, Cui C, Wang Z, Cui S, Zhu C
2019 22nd International Conference on Electrical Machines and Systems (ICEMS), Harbin, China. IEEE: pp. 1-5; ISBN 978-1-7281-3399-7
-
2019,
Ibrahim AU, Zhong W, Cui H, Li H, Xu D
2019 IEEE Energy Conversion Congress and Exposition (ECCE), Baltimore, MD, USA. IEEE: pp. 4575-4579; ISBN 978-1-7281-0396-9
-
2019,
Mohammad M, Pries J, Onar O, Anwar S, Galigekere VP, Su GJ, Wilkins J
2019 IEEE Energy Conversion Congress and Exposition (ECCE), Baltimore, MD, USA. IEEE: pp. 5733-5739; ISBN 978-1-7281-0396-9
-
2019,
Feng X, Chen X, Wang Y, Wang J
2019 8th International Symposium on Next Generation Electronics (ISNE), Zhengzhou, China. IEEE: pp. 1-3; ISBN 978-1-7281-2063-8
-
2019,
Miwa K, Takenaka T, Hirata A
IEEE Trans Electromagn Compat 61 (6): 2024-2030
-
2019,
He Y, Leung PSW, Chow Y, Diao Y
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 750-753; ISBN 978-1-7281-1639-6
-
2019,
Feng Z, Diao Y, Sun W, He Y, Leung PSW
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 48-51; ISBN 978-1-7281-1639-6
-
2019,
Wen F, Li Q, Li R, Liu L, Wu T
2019 IEEE Innovative Smart Grid Technologies - Asia (ISGT Asia), Chengdu, China. IEEE: pp. 4117-4121; ISBN 978-1-7281-3521-2