The following terms were included:
"intermediate frequency", Zwischenfrequenz, 中間周波
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2018,
Zucca M, Loader B, Schmidt M, Welinder J, Tammi K, Bruna Romero J, Pichon L, Freschi F, Bauer P, Blandow V, Maffucci A, Femia N, Kuster N
2018 Conference on Precision Electromagnetic Measurements (CPEM 2018), Paris, France. IEEE: pp. 1-2; ISBN 978-1-5386-2130-1
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2018,
Cimala C, Clemens M, Streckert J, Schmuelling B
Int J Numer Model 31 (2): e2231
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BGBl I (41): 2187-2196
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2018,
Mishra AK, Kokate PA, Lokhande SK, Middey A, Bodhe GL
Singh V, Yadav S, Yadava R (eds.): Environmental Pollution. Water Science and Technology Library, volume 77; Springer, Singapore; pp. 181-191; ISBN 978-981-10-5791-5
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2018,
Wdowiak A, Mazurek PA, Wdowiak A, Bojar I
Int J Occup Med Environ Health 31 (6): 723-739
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2018,
Chen J, Ruddle AR, Xian Teo Y
2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands. IEEE: pp. 860-865; ISBN 978-1-4673-9699-8
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2018,
Aga K, Hirata A, Laakso I, Tarao H, Diao Y, Ito T, Sekiba Y, Yamazaki K
IEEE Access 6: 70964-70973
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2018 9th International Conference on Ultrawideband and Ultrashort Impulse Signals (UWBUSIS), Odessa, Ukraine. IEEE: pp. 69-73; ISBN 978-1-5386-2469-2
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2018 IEEE International Symposium on Signal Processing and Information Technology (ISSPIT), Louisville, KY, USA. IEEE: pp. 1-5; ISBN 978-1-5386-7569-4
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2018,
Teplan M, Bereta M, Bajla I, Bartosova K, Dermek T, Haba Y, Cifra M
2018 EMF-Med 1st World Conference on Biomedical Applications of Electromagnetic Fields (EMF-Med), Split, Croatia. IEEE: pp. 1-2; ISBN 978-1-5386-5922-9
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2018,
Aga K, Hirata A, Laakso I
2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands. IEEE: pp. 515-520; ISBN 978-1-4673-9699-8
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2018,
Maity S, Das D, Chatterjee B, Sen S
2018 40th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Honolulu, HI, USA. IEEE: pp. 3754-3757; ISBN 978-1-5386-3647-3
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2018,
Meijer DKF, Geesink HJH
J Cancer Ther 9 (3): 188-230
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2018,
Zhao Y, Lai JJ, Wu XY, Qu W, Wang MQ, Chen L, Hu N, Wang X, Hou WS
2018 40th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Honolulu, HI, USA. IEEE: pp. 2240-2243; ISBN 978-1-5386-3647-3
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International Telecommunication Union (ITU),
ITU-T Recommendations K-Series, K.91 (01/2018): 1-80
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2018,
Djuric N, Kavecan N, Mitic M, Radosavljevic N, Boric A
2018 22nd International Microwave and Radar Conference (MIKON), Poznan, Poland. IEEE: pp. 258-260; ISBN 978-1-5386-3723-4
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2018,
Rasic P, Skiljo M, Blazevic Z, Doric V, Poljak D
2018 3rd International Conference on Smart and Sustainable Technologies (SpliTech), Split, Croatia. IEEE: pp. 1-6; ISBN 978-1-5386-6296-0
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International Telecommunication Union (ITU),
ITU-T Recommendations K-Series, K.61 (01/2018): 1-30
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2018,
Elnait KEI, Huang L, Tan L, Wang S, Wu X
2018 IEEE PES Asia-Pacific Power and Energy Engineering Conference (APPEEC), Kota Kinabalu, Malaysia. IEEE: pp. 56-59; ISBN 978-1-5386-5687-7
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2018,
Taphoorn MJB, Dirven L, Kanner AA, Lavy-Shahaf G, Weinberg U, Taillibert S, Toms SA, Honnorat J, Chen TC, Sroubek J, David C, Idbaih A, Easaw JC, Kim CY, Bruna J, Hottinger AF, Kew Y, Roth P, Desai R, Villano JL, Kirson ED, Ram Z, Stupp R
JAMA Oncol 4 (4): 495-504
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2018,
Du X, Ma X, Li L, Li H, Cheng X, Hwang JCM
2018 IEEE/MTT-S International Microwave Symposium - IMS, Philadelphia, PA, USA. IEEE: pp. 1148-1151; ISBN 978-1-5386-5068-4
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2018,
Sadamitsu S, Leung SW, Lo WK, Sun WN
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: pp. 28-31; ISBN 978-1-5090-3955-5
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2018,
Kamimura Y, Inagaki S, Wake K
2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands. IEEE: pp. 855-859; ISBN 978-1-4673-9699-8
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2018,
Piper S, Ball L, Mandziuk M
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI), Long Beach, CA, USA. IEEE: pp. 448-453; ISBN 978-1-5386-6622-7
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2018,
Taguchi K, Laakso I, Aga K, Hirata A, Diao Y, Chakarothai J, Kashiwa T
IEEE Access 6: 70186 - 70196