The following terms were included:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
-
2022,
Li J, Changyuan W, Yujie Z
2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Beijing, China. IEEE: pp. 261-263; ISBN 978-1-6654-1672-6
-
2022,
Duris V, Ivanov VN, Chumarov SG
TEM J 11 (2): 920-925
-
2022,
Grazian F, Shi W, Soeiro TB, Dong J, Bauer P
2022 Wireless Power Week (WPW), Bordeaux, France. IEEE: pp. 54-59; ISBN 978-1-6654-8446-6
-
2022,
Zimmer S, Helwig M, Winkler A, Modler N
Electronics 11 (14): 2156
-
2022,
Kapetanović AL, Poljak D
IEEE Trans Electromagn Compat 64 (5): 1296-1303
-
Energies 15 (12): 4455
-
2022,
Bertoluzzo M, Di Barba P, Forzan M, Mognaschi ME, Sieni E
Eng Comput 39 (7): 2802-2819
-
2022,
Yang B, Chen CH, Graham SJ
IEEE Letters on Electromagnetic Compatibility Practice and Applications 4 (3): 83-87
-
2022,
Liu S, Onishi T, Taki M, Watanabe S
IEEE Trans Electromagn Compat 64 (4): 963-974
-
2022,
Gifuni A, Adil M, Grassini G, Buono A, Nunziata F, Micheli D, Migliaccio M
IEEE Trans Electromagn Compat 64 (4): 951-962
-
IEEE Trans Electromagn Compat 64 (4): 941-950
-
2022,
Xiao C, Hao S, Cheng D, Liao C
IEEE Trans Biomed Circuits Syst 16 (3): 372-383
-
2022,
Gryz K, Karpowicz J, Zradziński P
Sensors 22 (5): 1719
-
2022,
Shah IA, Basir A, Cho Y, Yoo H
IEEE Trans Electromagn Compat 64 (3): 640-649
-
2022,
Budnarowska M, Mizeraczyk J, Bisewski D
Prz Elektrotechniczny 98 (2): 110-113
-
2022,
Liu J, Wang Y, Guo R, Wang Q, Zheng J, Kurpad K, Kainz W, Chen J
IEEE Trans Electromagn Compat 64 (2): 286-294
-
2022,
Lan J, Diao Y, Duan X, Hirata A
IEEE Trans Electromagn Compat 64 (2): 551-558
-
2022,
Sassi O, Kadi M, Niederholz M
IEEE Trans Electromagn Compat 64 (1): 139-149
-
2022,
Narusue Y, Morikawa H
IEEE Trans Magn 58 (2): 1-5
-
Institute of Electrical and Electronics Engineers (IEEE),
IEEE Std 149-2021: 1-207, ISBN 978-1-5044-8017-8
-
2021,
EMF-Institut (Fachinstitut für Elektromagnetische Verträglichkeit zur Umwelt), Nießen P
1-28
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2021 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Nusa Dua - Bali, Indonesia. IEEE: pp. 1-4; ISBN 978-1-7281-7622-2
-
IEEE Trans Electromagn Compat 63 (1): 286-293
-
2021,
Kwon D, Lee YS, Lee AK, Choi HD
IEEE Trans Electromagn Compat 63 (2): 384-389
-
2021,
Ruddle AR, Martin AJM, Emery M
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: pp. 1-6; ISBN 978-1-6654-4889-5