RF-induced Heating Evaluation for Passive Device in Tissue-Reduced Virtual Family Models at 1.5 T
dev./impl.
By:
Xia M, Guo R, Zheng J, Chen J
Published in: 2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Spokane, WA, USA. IEEE, 2022: pp. 610-613; ISBN 978-1-6654-0930-8
