The following terms were included:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2014,
Cortina R, Masetti C
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1-4; ISBN 978-4-88552-287-1
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2014,
Bellan B, Betti P, Carillo D, D’Amore M, D’Arco M, De Capua C, Gaggelli A, Grandolfo M, Maradei F, Mariscotti A, Pignari S, Pozzobon P, Rossi P, Violi AG
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1201-1204; ISBN 978-4-88552-287-1
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2014,
Poljak D, Sarolic A, Roje V
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 965-968; ISBN 978-4-88552-287-1
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2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1-21; ISBN 978-4-88552-287-1
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2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 751-756; ISBN 978-4-88552-287-1
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2014,
Bit-Babik G, Faraone A
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1-6; ISBN 978-4-88552-287-1
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2014,
Sarolic A, Modlic B, Roje V, Poljak D, Pavic P
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 969-973; ISBN 978-4-88552-287-1
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2014,
Bitz A, Alaydrus M, Streckert J, Hansen VW
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 747-750; ISBN 978-4-88552-287-1
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2014,
Ruffilli L, D'Elia S, Barabino A
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1-6; ISBN 978-4-88552-287-1
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2014,
Flintoft ID, Porter SJ, Capstick MH, Marvin AC
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1-6; ISBN 978-4-88552-287-1