By:
Bellan B, Betti P, Carillo D, D’Amore M, D’Arco M, De Capua C, Gaggelli A, Grandolfo M, Maradei F, Mariscotti A, Pignari S, Pozzobon P, Rossi P, Violi AG
Published in: 2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE, 2014: pp. 1201-1204; ISBN 978-4-88552-287-1
