The following terms were included:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2019,
Feng Z, Diao Y, Sun W, He Y, Leung PSW
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 48-51; ISBN 978-1-7281-1639-6
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2019,
Laakso I, Lehtinen T
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 334-337; ISBN 978-1-7281-1639-6
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2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Barcelona, Spain. IEEE: pp. 82-87; ISBN 978-1-7281-0595-6
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2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Barcelona, Spain. IEEE: pp. 1020-1024; ISBN 978-1-7281-0595-6
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2019,
Gryz K, Karpowicz J
2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Barcelona, Spain. IEEE: pp. 1030-1033; ISBN 978-1-7281-0595-6
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2019,
Alilou O, Grange F, Abdelli N, Journet S, Ribeiro J, Kouassi A, Maniscalco C, Machet A
2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Barcelona, Spain. IEEE: pp. 1034-1038; ISBN 978-1-7281-0595-6
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2019,
Bechet AC, Helbet R, Miclaus S, Bouleanu I, Sarbu A, Bechet P
2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Barcelona, Spain. IEEE: pp. 1025-1029; ISBN 978-1-7281-0595-6
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2019,
Campi T, Cruciani S, Maradei F, Feliziani M
2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Barcelona, Spain. IEEE: pp. 1116-1121; ISBN 978-1-7281-0595-6
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2019,
De Miguel-Bilbao S, Blas J, Karpowicz J, Ramos V
2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Barcelona, Spain. IEEE: pp. 1112-1115; ISBN 978-1-7281-0595-6
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2019,
Willmann B, Rabe H, Leugers C, Sassi O, Waldera C, Vick R
2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Barcelona, Spain. IEEE: pp. 513-517; ISBN 978-1-7281-0595-6
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2019,
Gomez-Tames J, Tarnaud T, Miwa K, Hirata A, Van de Steene T, Martens L, Tanghe E, Joseph W
IEEE Trans Electromagn Compat 61 (6): 1944 - 1952
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German Commission on Radiological Protection (SSK),
1-45
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2019,
Grazian F, Shi W, Dong J, van Duijsen P, Soeiro TB, Bauer P
2019 AEIT International Conference of Electrical and Electronic Technologies for Automotive (AEIT AUTOMOTIVE), Torino, Italy. IEEE: pp. 1-5; ISBN 978-1-7281-3278-5
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2019,
Lagouanelle P, Krauth VL, Pichon L
2019 AEIT International Conference of Electrical and Electronic Technologies for Automotive (AEIT AUTOMOTIVE), Torino, Italy. IEEE: pp. 1-5; ISBN 978-1-7281-3278-5
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2019,
Klos-Witkowska A, Martsenyuk V, Karpinski M, Obeidat I
2019 Advances in Science and Engineering Technology International Conferences (ASET), Dubai, United Arab Emirates. IEEE: pp. 1-5; ISBN 978-1-5386-8272-2
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2019,
Rathebe PC, Mbonane TP
2018 IEEE 4th Global Electromagnetic Compatibility Conference (GEMCCON), Stellenbosch, South Africa. IEEE: pp. 1-3; ISBN 978-1-5386-5729-4
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2019,
Nefzi A, Lemercier CE, El Khoueiry C, Lewis N, Lagroye I, Boucsein C, Leveque P, Arnaud-Cormos D
2019 IEEE MTT-S International Microwave Biomedical Conference (IMBioC), Nanjing, China. IEEE: pp. 1-3; ISBN 978-1-5386-7396-6
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2019,
Li X, Zhu F, Lu H, Qiu R, Tang Y
IEEE Trans Electromagn Compat 61 (2): 319 - 326
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2019,
Atefi SR, Serano P, Poulsen C, Angelone LM, Bonmassar G
IEEE Trans Electromagn Compat 61 (3): 852-859
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2019 11th International Symposium on Advanced Topics in Electrical Engineering (ATEE), Bucharest, Romania. IEEE: pp. 1-5; ISBN 978-1-7281-0102-6
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2019,
Campi T, Cruciani S, Maradei F, Feliziani M
IEEE Trans Electromagn Compat 61 (6): 1935 - 1943
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2019,
Zhou Y, Zhang W, Yu H
Zhongguo Yi Liao Qi Xie Za Zhi 43 (2): 94-98
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2019,
Omi S, Uno T, Arima T, Wiart J
IEEE Trans Electromagn Compat 61 (1): 48 - 56
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2019,
Yang R, Zheng J, Wang Y, Guo R, Kainz W, Chen J
IEEE Trans Electromagn Compat 61 (6): 1726 - 1732
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2019,
Ji X, Zheng J, Yang R, Kainz W, Chen J
IEEE Trans Electromagn Compat 61 (1): 57 - 64