The following terms were included:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2024,
Zuo Z, Wang Q, Zheng J, Jeong H, Kumar A, Chen J
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: pp. 369-373; ISBN 9798350360400
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2024,
Huang X, Scoles S, Nguyen P, Chen J, Wisniewski J, Wan Y, Jiang GJ
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: pp. 365-368; ISBN 9798350360400
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2024,
Lee C, Rhee J, Lee S, Kwon H, Park Y, Shin Y, Ahn S
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: pp. 604-607; ISBN 9798350360400
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2024,
Ardeshirpour Y, Guag J, Silberberg JL, Seidman SJ
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: pp. 359-364; ISBN 9798350360400
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2024,
Cvetković M, Poljak D, Dodig H
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: pp. 167-172; ISBN 9798350360400
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2024,
Campi T, Cruciani S, Maradei F, Feliziani M
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: pp. 446-449; ISBN 9798350360400
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2024,
Clemente GC, Morais GI, Fonseca FHS, Concentino GL, Fraidenraich G
IEEE Electromagn Compat Mag 13 (2): 40-53
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2024,
Jacksha RD, Sunderman CB, Zhou C
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: pp. 205-210; ISBN 9798350360400
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2024,
Xiao S, Zhang ZQ, Su TZ, Zhang JB, Xiao Jia
2024 International Conference on Electromagnetics in Advanced Applications (ICEAA), Lisbon, Portugal. IEEE: pp. 250-253; ISBN 9798350360981
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2024,
Pandeya M, Solanki MS, Suresh VG
2024 2nd World Conference on Communication & Computing (WCONF), RAIPUR, India. IEEE: pp. 1-5; ISBN 9798350395334
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2024,
Cruciani S, Campi T, Maradei F, Feliziani M
Energies 17 (17): 4233
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2024,
Akter MK, Guo R, Islam MZ, Zheng J, Kainz W, Long SA, Chen J
IEEE Trans Electromagn Compat 66 (4): 1041-1056
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2024,
Esmaeili H, Yang C, Schuster C
IEEE Trans Electromagn Compat [in press]
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2024,
Campi T, Cruciani S, Maradei F, Feliziani M
IEEE Access 12: 109750-109758
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2024,
Di Capua G, Maffucci A, Capriglione D, Di Mambro G, Femia N, Oliva N, De Guglielmo L
2024 IEEE International Symposium on Measurements & Networking (M&N), Rome, Italy. IEEE: pp. 1-6; ISBN 9798350370546
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2024,
Ishida K, Fujii K, Hanada E
J Med Syst 48 (1): 72
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2024,
Li B, Zhang X, Qiao N, Chen J, Bi W, Zhi W, Ma L, Miao C, Wang L, Zou Y, Hu X
Bioelectromagnetics [in press]
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2024,
Li J, Dengyu Z, Yujie Z, Yuechen G
2024 IEEE 7th International Electrical and Energy Conference (CIEEC), Harbin, China. IEEE: pp. 3488-3491; ISBN 9798350359565
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2024,
Zhan L, Shi D, Zhou X, Gou Y
2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), Ginowan, Okinawa, Japan. IEEE, Japan: pp. 159-162; ISBN 9798350349498
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2024,
Sufian MA, Abbas A, Choi D, Lee J, Hussain N, Kim N
2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), Ginowan, Okinawa, Japan. IEEE, Japan: pp. 247-249; ISBN 9798350349498
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2024,
Kuster N, Xi J, Christ A
2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), Ginowan, Okinawa, Japan. IEEE, Japan: pp. 251-254; ISBN 9798350349498
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2024,
Censi F, Vivarelli C, Mattei E, Calcagnini G, Bogi A, Comelli M, Zoppetti N, Burriesci G, D’Agostino S, Falsaperla R
2024 4th URSI Atlantic Radio Science Meeting (AT-RASC), Meloneras, Spain. IEEE, Spanien: pp. 1-4; ISBN 9798350360257
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2024,
Diao Y, Kodera S, Li K, Hirata A
IEEE Trans Electromagn Compat [in press]
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Institute of Electrical and Electronics Engineers (IEEE),
P2725.1/D4, Aug 2024: 1-65, ISBN 9798855712186
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Institute of Electrical and Electronics Engineers (IEEE),
P2725.1/D3, Jun 2024: 1-65, ISBN 9798855709759
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2024,
Ali Hamed SM, Alsaif H
IEEE Access 12: 89353-89362
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2024,
Yang X, Guo R, Zheng J, Chen X, Chen J
IEEE Trans Electromagn Compat 66 (4): 1029-1040
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2024,
Dianovský R, Pecho P, Hrúz M, Velký P
2024 New Trends in Civil Aviation (NTCA), Prague, Czech Republic. IEEE: pp. 133-139; ISBN 9798350317961
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2024,
Yao A, Pei Y, He J, Wang J, Yang P
IEEE Trans Electromagn Compat 66 (2): 405-416
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2024,
Woo S, Shin Y, Lee C, Moon J, Kim H, Kim H, Huh S, Ahn S
IEEE Trans Electromagn Compat 66 (3): 1015-1028
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2024,
Yao M, Pedersen GF, Zhang S
IEEE Trans Electromagn Compat 66 (3): 706-719
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2024,
Vivarelli C, Censi F, Calcagnini G, Falsaperla R, Mattei E
Health Phys 127 (2): 269-275
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2024,
Zhou C, Snyder DP, Epstein B, Robinson ZT, Jin GY, Tang PY, Polcawich RG, Roper M
IEEE Trans Electromagn Compat 66 (3): 720-727
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Energies 17 (1): 126
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2024,
Quercio M, Lozito GM, Corti F, Riganti Fulginei F, Laudani A
IEEE Access 12: 16728-16740
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2024,
Sufian MA, Hussain N
IEEE Trans Electromagn Compat 66 (2): 417-426
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2024,
Vivarelli C, Censi F, Calcagnini G, Freschi F, Giaccone L, Canova A, Mattei E
IEEE Trans Electromagn Compat 66 (1): 97-107
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2024,
Xu Z, Rodriguez-Villegas E
IEEE Trans Biomed Circuits Syst 18 (2): 460-473
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IEEE Trans Electromagn Compat 66 (2): 392-404
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2024,
David A, Tiemann M, Haussmann N, Stroka S, Clemens M, Schmuelling B
IEEE Ind Appl Mag 30 (1): 59-67
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2024,
Zhekov SS, Yao M, Di Paola C, Xu B, Zhang S
IEEE Trans Electromagn Compat 66 (1): 61-69
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2024,
Ardeshirpour Y, Cohen ED, Seidman SJ, Taddese B, Zaidi T, Bassen H
Bioelectromagnetics 45 (2): 70-81
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2024,
Kirawanich P, Dey P, Sumpavakup C
IEEE Trans Transp Electrif 10 (2): 4571-4582
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2023,
Rhee J, Ahn J, Kim H, Lee C, Ahn S
2023 XXXVth General Assembly and Scientific Symposium of the International Union of Radio Science (URSI GASS), Sapporo, Japan. IEEE: pp. 1-4; ISBN 9798350309973
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2023,
Gutiérrez-Martínez J, Toledo-Peral CL, Vega-Martínez G, Mercado-Gutiérrez JA
2023 Global Medical Engineering Physics Exchanges/Pacific Health Care Engineering (GMEPE/PAHCE), Songdo, Korea, Republic of. IEEE: pp. 1-6; ISBN 9798350304015
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2023,
Vélez RS, van Helvoort MJAM, Vogt-Ardatjew R, Van den Berg B, Leferink F
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: pp. 1-6; ISBN 9798350324013
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2023,
Zhou X, Dou L, Huang H, Shen Q, Zhou X, Li A, Tang W, Pang X, Zhang Y, Wu T
2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC), Hangzhou, China. IEEE: pp. 1-5; ISBN 9798350333114
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2023,
Xinhua P, Xin Z, Huixiong H, Qingfei S, Anxiang L, Wei T, Chao Y, Tong W
2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC), Hangzhou, China. IEEE: pp. 1-5; ISBN 9798350333114
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2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC), Hangzhou, China. IEEE: pp. 1-4; ISBN 9798350333114
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2023,
Li C, Sha S, Zhao H, Xing L, Xu Q
2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC), Hangzhou, China. IEEE: pp. 1-3; ISBN 9798350333114