By:
Wagih M, Balocchi L, Benassi F, Carvalho NB, Chiao JC, Correia R, Costanzo A, Cui Y, Georgiadou D, Gouveia C, Grosinger J, Ho JS, Hu K, Komolafe A, Lemey S, Loss C, Marrocco G, Mitcheson P, Palazzi V, Panunzio N, Paolini G, Pinho P, Preishueber-Pflugl J, Qaragoez Y, Rahmani H, Rogier H, Lopera JR, Roselli L, Schreurs D, Tentzeris M, Tian X, Torah R, Torres R, Van Torre P, Vital D, Beeby S
Published in: IEEE J Microw 2023; 3 (1): 193-226
