By:
Watanalaorsomboon S, Punpai S, Tanechpongtamb W, Tarateeraseth V
Published in: 2021 18th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON), Chiang Mai, Thailand. IEEE, 2021: pp. 654-657; ISBN 978-1-6654-4738-6